2024-08-30 |
NXGWTYOCNH74311 |
DISCO CORP |
1048.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-07-13 |
NEDFTYOCMJ35951 |
DISCO CORP |
4037.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-07-07 |
NEDFTYOCLZ42230 |
DISCO CORP |
2593.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-06-14 |
NEDFTYOCKW64825 |
DISCO CORP |
1975.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-05-22 |
NEDFTYOCKN07475 |
DISCO CORP |
5546.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-04-22 |
NEDFTYOCJN47234 |
DISCO CORP |
1285.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-03-16 |
NEDFTYOCHL13270 |
DISCO CORP |
11645.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-02-06 |
NEDFTYOCGT68890 |
DISCO CORP |
2240.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2024-01-03 |
NEDFTYOCEP54941 |
DISCO CORP |
597.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2023-11-19 |
NEDFTYOCEJ75425 |
DISCO CORP |
1955.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2023-11-09 |
NEDFTYOCDM32892 |
DISCO CORP |
5090.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2023-10-19 |
NEDFTYOCCX13544 |
DISCO CORP |
1070.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
2023-08-18 |
NEDFTYOCAC15301 |
DISCO CORP |
687.0 kg |
854290
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
2023-08-08 |
NEDFTYOCAP30874 |
DISCO CORP |
1277.0 kg |
854290
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
2023-08-01 |
NEDFTYOCAD70885 |
DISCO CORP |
1336.0 kg |
854290
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
2023-07-27 |
KMGMOSAD32118300 |
DISCO CORP |
2077.0 kg |
851590
|
MACHINE PARTS |
2023-07-06 |
NEDFTYOBZG39860 |
DISCO CORP |
660.0 kg |
390311
|
POLYSTYRENE |
2023-06-09 |
NEDFTYOBYF23666 |
DISCO CORP |
1535.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-05-05 |
NEDFTYOBXS54605 |
DISCO CORP |
1545.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-05-05 |
NEDFTYOBXM88585 |
DISCO CORP |
2250.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-04-07 |
NEDFTYOBWW81866 |
DISCO CORP |
1540.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-03-31 |
KMGMTCLW3004091 |
DISCO CORP |
278.0 kg |
852010
|
POWER LIFTER |
2023-03-24 |
NEDFTYOBVM39130 |
DISCO CORP |
13407.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-03-17 |
NEDFTYOBVZ96235 |
DISCO CORP |
1555.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-03-09 |
NEDFTYOBVH30535 |
DISCO CORP |
7025.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2023-01-30 |
NEDFTYOBTD70242 |
DISCO CORP |
1070.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-12-22 |
NEDFTYOBSF34612 |
DISCO CORP |
1480.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-12-06 |
NEDFTYOBRV70663 |
DISCO CORP |
526.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-11-09 |
NEDFTYOBRC13624 |
DISCO CORP |
2285.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2022-10-18 |
NEDFTYOBPA21921 |
DISCO CORP |
518.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2022-09-20 |
NEDFTYOBNJ53881 |
DISCO CORP |
681.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-09-05 |
NEDFTYOBLG20185 |
DISCO CORP |
1067.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2022-08-31 |
NEDFTYOBMV61591 |
DISCO CORP |
1370.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-08-31 |
NEDFTYOBMW56264 |
DISCO CORP |
516.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-08-18 |
NEDFTYOBMK53534 |
DISCO CORP |
274.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-08-17 |
NEDFTYOBMF84350 |
DISCO CORP |
518.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-08-10 |
NEDFTPSFWSE84035 |
MICRON MEMORY TAIWAN CO LTD |
3525.0 kg |
901320
|
FULLY AUTOMATIC LASER SAW MODEL:DFL7361 MICAP#1286852 (DFL7361 STEALTH LASER DICER STANDARD) |
2022-08-09 |
NEDFTYOBLV87803 |
DISCO CORP |
1386.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-07-15 |
NEDFTYOBLK52844 |
DISCO CORP |
129.0 kg |
390311
|
POLYSTYRENE |
2022-06-23 |
NEDFTYOBKV37983 |
DISCO CORP |
1875.0 kg |
903141
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
2022-06-17 |
NEDFTYOBKV37110 |
DISCO CORP |
127.0 kg |
390311
|
POLYSTYRENE |
2022-06-09 |
NEDFTYOBKK07202 |
DISCO CORP |
1287.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-06-09 |
NEDFTYOBKK08860 |
DISCO CORP |
1352.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-03-23 |
NEDFTYOBGR69362 |
DISCO CORP |
675.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-02-10 |
NEDFTYOBEY88824 |
DISCO CORP |
1870.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-02-08 |
NEDFTYOBEP65800 |
DISCO CORP |
519.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-01-20 |
NEDFTYOBEY90121 |
DISCO CORP |
1282.0 kg |
847989
|
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
2022-01-05 |
NEDFOSABFA61455 |
OHMIYA IND CO LTD |
470.0 kg |
846410
|
MACHINES FOR MANUFACTURE OF BOULES OR WAFERS |
2021-11-22 |
KLLMJP1083158 |
DISCO CORP |
525.0 kg |
820299
|
AUTOMATIC DICING SAW . . . . . . . . |
2021-11-12 |
TSJLYLKS1060599 |
DISCO CORP |
523.0 kg |
848620
|
AUTOMATIC DICING SAW HS CODE 8486.20 |