DISCO HI TEC AMERICA INC
DISCO HI TEC AMERICA INC's Shipments Over Time
Purchase Ratings
Shipment Reliability and Frequency Volume of Goods
Avg. Shipments per Month: 0.92 Average TEU per month: 1.54
Active Months: 10 Average TEU per Shipment: 1.54
Shipment Frequency Std. Dev.: 0.64
Shipments By Companies
Company Name Shipments
DISCO CORP 66 shipments
MICRON MEMORY TAIWAN CO LTD 1 shipments
OHMIYA IND CO LTD 1 shipments
Shipments By HS Code
HS Code Shipments
847989 Machinery and mechanical appliances; having individual functions, n.e.c. in this chapter : Machines and mechanical appliances; having individual functions, n.e.c. or included in this chapter 26 shipments
846410 Machine-tools; for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass : Machine-tools; sawing machines, for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass 14 shipments
903141 Measuring or checking instruments, appliances and machines, n.e.c. or included in this chapter; profile projectors : Optical instruments and appliances; for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices, n.e.c. in chapter 90 13 shipments
390311 Polymers of styrene, in primary forms : Styrene polymers; expansible polystyrene, in primary forms 3 shipments
854290 Electronic integrated circuits : Parts of electronic integrated circuits 3 shipments
490191 Printed books, brochures, leaflets and similar printed matter, whether or not in single sheets : Printed matter; dictionaries, encyclopaedias and serial instalments thereof 2 shipments
820299 Tools, hand; saws and blades for saws of all kinds (including slitting, slotting or toothless blades) : Tools, hand; saw blades n.e.c. in heading no. 8202 1 shipments
848620 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 9-C to this Chapter : Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits 1 shipments
851521 Electric (electrically heated gas) soldering, brazing, welding machines and apparatus, capable or not of cutting, electric machines and apparatus for hot spraying of metals or sintered carbides : Welding machines and apparatus; for resistance welding of metal, fully or partly automatic, whether or not capable of cutting 1 shipments
851590 Electric (electrically heated gas) soldering, brazing, welding machines and apparatus, capable or not of cutting, electric machines and apparatus for hot spraying of metals or sintered carbides : Welding, brazing or soldering machines; parts of the machines of heading no. 8515 1 shipments
852010 1 shipments
901320 Liquid crystal devices not constituting articles provided for more specifically in other headings; lasers, not laser diodes; other optical appliances and instruments n.e.c. in this chapter : Lasers; other than laser diodes 1 shipments
902230 X-ray, alpha, beta, gamma radiation apparatus; x-ray tubes, x-ray generators, high tension generators, control panels and desks, screens, examination or treatment tables, chairs and the like : X-ray tubes 1 shipments
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Latest Shipments
Arrival Date Bill Of Lading Shipper Weight HS Code Description
2024-08-30 NXGWTYOCNH74311 DISCO CORP 1048.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-13 NEDFTYOCMJ35951 DISCO CORP 4037.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-07 NEDFTYOCLZ42230 DISCO CORP 2593.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 NEDFTYOCKW64825 DISCO CORP 1975.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-22 NEDFTYOCKN07475 DISCO CORP 5546.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-22 NEDFTYOCJN47234 DISCO CORP 1285.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-03-16 NEDFTYOCHL13270 DISCO CORP 11645.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-02-06 NEDFTYOCGT68890 DISCO CORP 2240.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-03 NEDFTYOCEP54941 DISCO CORP 597.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-11-19 NEDFTYOCEJ75425 DISCO CORP 1955.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-11-09 NEDFTYOCDM32892 DISCO CORP 5090.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-10-19 NEDFTYOCCX13544 DISCO CORP 1070.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-08-18 NEDFTYOCAC15301 DISCO CORP 687.0 kg 854290 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS
2023-08-08 NEDFTYOCAP30874 DISCO CORP 1277.0 kg 854290 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS
2023-08-01 NEDFTYOCAD70885 DISCO CORP 1336.0 kg 854290 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS
2023-07-27 KMGMOSAD32118300 DISCO CORP 2077.0 kg 851590 MACHINE PARTS
2023-07-06 NEDFTYOBZG39860 DISCO CORP 660.0 kg 390311 POLYSTYRENE
2023-06-09 NEDFTYOBYF23666 DISCO CORP 1535.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-05-05 NEDFTYOBXS54605 DISCO CORP 1545.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-05-05 NEDFTYOBXM88585 DISCO CORP 2250.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-04-07 NEDFTYOBWW81866 DISCO CORP 1540.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-03-31 KMGMTCLW3004091 DISCO CORP 278.0 kg 852010 POWER LIFTER
2023-03-24 NEDFTYOBVM39130 DISCO CORP 13407.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-03-17 NEDFTYOBVZ96235 DISCO CORP 1555.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-03-09 NEDFTYOBVH30535 DISCO CORP 7025.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2023-01-30 NEDFTYOBTD70242 DISCO CORP 1070.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-12-22 NEDFTYOBSF34612 DISCO CORP 1480.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-12-06 NEDFTYOBRV70663 DISCO CORP 526.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-11-09 NEDFTYOBRC13624 DISCO CORP 2285.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2022-10-18 NEDFTYOBPA21921 DISCO CORP 518.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2022-09-20 NEDFTYOBNJ53881 DISCO CORP 681.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-09-05 NEDFTYOBLG20185 DISCO CORP 1067.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2022-08-31 NEDFTYOBMV61591 DISCO CORP 1370.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-08-31 NEDFTYOBMW56264 DISCO CORP 516.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-08-18 NEDFTYOBMK53534 DISCO CORP 274.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-08-17 NEDFTYOBMF84350 DISCO CORP 518.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-08-10 NEDFTPSFWSE84035 MICRON MEMORY TAIWAN CO LTD 3525.0 kg 901320 FULLY AUTOMATIC LASER SAW MODEL:DFL7361 MICAP#1286852 (DFL7361 STEALTH LASER DICER STANDARD)
2022-08-09 NEDFTYOBLV87803 DISCO CORP 1386.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-07-15 NEDFTYOBLK52844 DISCO CORP 129.0 kg 390311 POLYSTYRENE
2022-06-23 NEDFTYOBKV37983 DISCO CORP 1875.0 kg 903141 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE
2022-06-17 NEDFTYOBKV37110 DISCO CORP 127.0 kg 390311 POLYSTYRENE
2022-06-09 NEDFTYOBKK07202 DISCO CORP 1287.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-06-09 NEDFTYOBKK08860 DISCO CORP 1352.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-03-23 NEDFTYOBGR69362 DISCO CORP 675.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-02-10 NEDFTYOBEY88824 DISCO CORP 1870.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-02-08 NEDFTYOBEP65800 DISCO CORP 519.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-01-20 NEDFTYOBEY90121 DISCO CORP 1282.0 kg 847989 MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS
2022-01-05 NEDFOSABFA61455 OHMIYA IND CO LTD 470.0 kg 846410 MACHINES FOR MANUFACTURE OF BOULES OR WAFERS
2021-11-22 KLLMJP1083158 DISCO CORP 525.0 kg 820299 AUTOMATIC DICING SAW . . . . . . . .
2021-11-12 TSJLYLKS1060599 DISCO CORP 523.0 kg 848620 AUTOMATIC DICING SAW HS CODE 8486.20
Contact information
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Other address
5921 OPTICAL ST SAN JOSE CA 95138 USA
5921 OPTICAL CT SAN JOSE CA 95138 USA
5921 OPTICAL CT
3270 SCOTT BOULEVARD SANTA CLARA CA 95054-3011 U S A
5921 OPTICAL CT SAN JOSE CA 95138 US
5921 OPTICAL CT SAN JOSE USA 95138 CALIFORNIA LISA MILLIARD
5921 OPTICAL COURT SAN JOSE CA 9 USA SAN JOSE CA 95138 UNITED STATES
5921 OPTICAL COURT SAN JOSE CA 95138 USATEL:408-987-3776 ATTN:MR DEVIN
5921 OPTICAL CT SAN JOSE USA 95138 CALIFORNIA
598 AIRPORT BLVD STE 300 MORRISVILLNC 27560 USA 919-468-6003