| Shipment Reliability and Frequency | Volume of Goods |
|---|---|
| Avg. Shipments per Month: 0.65 | Average TEU per month: 1.29 |
| Active Months: 8 | Average TEU per Shipment: 1.41 |
| Shipment Frequency Std. Dev.: 0.79 |
| Company Name | Shipments |
|---|---|
| SEMICONDUCTOR COMPONENTS INDUSTRIES | 7 shipments |
| AMKOR TECHNOLOGY MALAYSIA SDN BHD | 3 shipments |
| ASE ELECTRONICS M SDN BHD | 2 shipments |
| SEMICONDUCTOR COMPONENT INDUSTRIES | 2 shipments |
| TONG HSING ELECTRONIC IND LTD | 2 shipments |
| UTAC THAI LIMITED | 2 shipments |
| ADVANCED SEMICONDUCTOR ENGINEERING INC CHUNG LI BRANCH | 1 shipments |
| DHL SUPPLY CHAIN MANAGEMENT | 1 shipments |
| DHL SUPPLY CHAIN MANAGEMENT PHILIP | 1 shipments |
| HANA SEMICONDUCTOR AYUTHAYA | 1 shipments |
| KING YUAN ELECTRONICS CO LTD | 1 shipments |
| KYEC CHU NAN AFFILIATED WITH KING YUAN ELECTRONICS CO LTD | 1 shipments |
| TONG HSING ELECTRONIC INDUSTRIES L | 1 shipments |
| UTAC HEADQUARTERS PTE | 1 shipments |
| HS Code | Shipments |
|---|---|
| 845430 Converters, ladles, ingot moulds and casting machines; of a kind used metallurgy or in metal foundries : Casting machines; of a kind used in metallurgy or in metal foundries | 5 shipments |
| 854389 Electrical machines and apparatus; having individual functions, not specified or included elsewhere in this chapter | 4 shipments |
| 854129 Diodes, transistors, similar semiconductor devices; including photovoltaic cells assembled or not in modules or panels, light-emitting diodes (LED), mounted piezo-electric crystals : Electrical apparatus; transistors, (other than photosensitive), with a dissipation rate of 1W or more | 2 shipments |
| 854221 Electronic integrated circuits | 2 shipments |
| 854239 Electronic integrated circuits : Electronic integrated circuits; n.e.c. in heading no. 8542 | 2 shipments |
| 854260 Electronic integrated circuits | 2 shipments |
| 854290 Electronic integrated circuits : Parts of electronic integrated circuits | 2 shipments |
| 560490 Rubber thread and cord, textile covered; textile yarn and strip and the like of heading no. 5404, 5405; impregnated, coated, covered or sheathed with rubber or plastics : Yarn; textile yarn, strip, and the like of heading no. 5404 or 5405, impregnated, coated, covered, or sheathed with rubber or plastics, n.e.c. in heading no. 5604 | 1 shipments |
| 701720 Laboratory, hygienic or pharmaceutical glassware, whether or not graduated or calibrated : Glassware; laboratory, hygienic or pharmaceutical, whether or not graduated or calibrated, having a linear co-efficient of expansion not over 5 x 10 (to the minus 6), (or 0.000005)) per Kelvin with a temperature of 0-300 degrees C | 1 shipments |
| 720450 Ferrous waste and scrap; remelting scrap ingots of iron or steel : Ferrous products; remelting scrap ingots | 1 shipments |
| 831130 Wires, rods, tubes, plates, electrodes of base metal or metal carbides; of a kind used for soldering, brazing, welding; wires and rods for metal spraying : Rods and wire; coated rods and cored wire, of base metal, for soldering, brazing or welding by flame | 1 shipments |
| 853890 Electrical apparatus; parts suitable for use solely or principally with the apparatus of heading no. 8535, 8536 and 8537 : Electrical apparatus; parts suitable for use solely or principally with the apparatus of heading no. 8535, 8536 or 8537 | 1 shipments |
| 911290 Clock cases and cases of a similar type for other goods of this chapter and parts thereof : Clock cases and similar cases for other goods of chapter 91; other than watch cases, parts thereof | 1 shipments |
| 960860 Pens; ball-point, felt tipped, other porous tipped pens; fountain pens, stylograph pens duplicating stylos, propelling or sliding pencils; parts of the foregoing, excluding those of heading no. 9609 : Pens; ball-point, refills comprising the ball point and ink-reservoir | 1 shipments |
| Arrival Date | Bill Of Lading | Shipper | Weight | HS Code | Description |
|---|---|---|---|---|---|
| 2024-08-24 | DFDSTP90056383 | TONG HSING ELECTRONIC IND LTD | 10488.0 kg | 854260 | INTEGRATED CIRCUITS |
| 2024-07-25 | DSVFSIN0449560 | SEMICONDUCTOR COMPONENT INDUSTRIES | 3563.0 kg | 854221 | SCRAP/ RECLAIM SILICON DIE ON MYLAR/ PRECIOUSMETAL (PM) ON FILM LOT # INTEGRATED CIRCUITI NVOICE NO: 161501413, 161501416, 161501418, 161501419, 161501421, 161501422 |
| 2024-06-27 | DSVFSIN0443474 | SEMICONDUCTOR COMPONENT INDUSTRIES | 8286.0 kg | 854221 | SCRAP/ RECLAIM SILICON DIE ON MYLAR/ PRECIOUSMETAL (PM) ON FILM LOT # INTEGRATED CIRCUITI NVOICE NO: 161498127, 161498130, 161498131, 161498134, 161498135 |
| 2024-05-25 | DFDSTP90052524 | KING YUAN ELECTRONICS CO LTD | 704.0 kg | 854389 | IC |
| 2024-05-12 | DSVFDSV0586310 | DHL SUPPLY CHAIN MANAGEMENT PHILIP | 7985.0 kg | 854260 | INTEGRATED CIRCUITS INTEGRATED CIRCUITS |
| 2024-01-19 | MLCWBKKH10000991 | UTAC THAI LIMITED | 3496.0 kg | 854389 | IC |
| 2024-01-14 | MLCWSINH10013101 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 4033.0 kg | 845430 | SCRAP / RECLAIM SILICON DIE ON MYLAR |
| 2023-10-06 | MLCWSINH10012657 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 3747.0 kg | 845430 | SCRAP / RECLAIM SILICON DIE ON MYLAR |
| 2023-09-29 | MLCWSE00023740 | TONG HSING ELECTRONIC IND LTD | 11708.0 kg | 854239 | IC W/O SOFTWARE HS CODE:8542.39 TOTAL: 20 PLTS = 501 CTNS |
| 2023-08-14 | MLCWSINH10012423 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 5895.0 kg | 845430 | SCRAP / RECLAIM SILICON DIE ON MYLAR |
| 2023-08-04 | MLCWKULH10004935 | ASE ELECTRONICS M SDN BHD | 341.0 kg | 701720 | I/C ASSY PART VFBGA 6.5SQ 2L , ILCC 10SQ INV NO:SCI13050201S |
| 2023-07-30 | MLCWBKKH10000605 | UTAC THAI LIMITED | 4406.0 kg | 854389 | IC , DIVE |
| 2023-07-13 | MLCWKULH10004903 | ASE ELECTRONICS M SDN BHD | 273.0 kg | 960860 | SHIPPING TRAY SOLDER BALL INV NO:SCI13050201S |
| 2023-06-27 | MLCWSE00017376 | KYEC CHU NAN AFFILIATED WITH KING YUAN ELECTRONICS CO LTD | 386.0 kg | 854239 | WAFER IC HS CODE:8542.39/8542.31 |
| 2023-05-18 | MLCWKULH10004824 | AMKOR TECHNOLOGY MALAYSIA SDN BHD | 519.0 kg | 854129 | SILICON PELLET TRANSISTOR HS CODE : 8541 29 0000 |
| 2023-05-07 | MLCWSINH10011967 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 4484.0 kg | 845430 | SCRAP / RECLAIM SILICON DIE ON MYLAR |
| 2023-04-13 | MLCWKULH10004756 | AMKOR TECHNOLOGY MALAYSIA SDN BHD | 1466.0 kg | 854129 | USA 86 CARTONS (INTO 3 PALLETS) OF RETURNABLE WAFER SKELETON HS CODE : 8541 29 0000 |
| 2023-03-17 | MLCWBKKH10000310 | HANA SEMICONDUCTOR AYUTHAYA | 3438.0 kg | 831130 | IC, LEAD FLAME, WAFER SKELETON |
| 2023-03-13 | MLCWSINH10011689 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 5701.0 kg | 845430 | SCRAP / RECLAIM SILICON DIE ON MYLAR |
| 2023-03-03 | DMALPKGA48170 | AMKOR TECHNOLOGY MALAYSIA SDN BHD | 9200.0 kg | 911290 | FINISHED GOOD & SEMI FINISHED GOOD |
| 2023-03-03 | MLCWSE00008506 | ADVANCED SEMICONDUCTOR ENGINEERING INC CHUNG LI BRANCH | 1586.0 kg | 854290 | LEAD FRAME 12 PALLETS = 138 BOXES HS CODE:8542.90 |
| 2023-01-16 | DMALSINB19710 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 4414.0 kg | 853890 | SCRAP MATERIAL INTERGRATED CIRCUIT |
| 2022-12-10 | DMALMNLA13170 | DHL SUPPLY CHAIN MANAGEMENT | 4125.0 kg | 854290 | OTHER, INTERGRATED CIRCUIT |
| 2022-12-06 | DMALTPEB10957 | TONG HSING ELECTRONIC INDUSTRIES L | 10968.0 kg | 560490 | IC W/O SOFTWARE IC W/O SOFTWARE IC W/O SOFTWARE INK DIE |
| 2022-11-01 | DMALSINB08972 | SEMICONDUCTOR COMPONENTS INDUSTRIES | 3083.0 kg | 720450 | SCRAP PRODUCTS |
| 2022-08-22 | MLCWBKK2207029 | UTAC HEADQUARTERS PTE | 2024.0 kg | 854389 | IC , DIVE |