| 2025-06-24 |
CCLLHAMS25560170 |
IBM DEUTSCHLAND GMBH |
13668.0 kg |
850699
|
IT EQUIPMENT |
| 2025-06-19 |
SHPT90509782 |
TOTALENERGIES OPERATING CENTER SCH |
6564.0 kg |
382000
|
ZITREC EC 21 READY MIX IBC 1000L HS 3820000090 |
| 2025-05-03 |
CCLLHAMS25558481 |
IBM DEUTSCHLAND GMBH |
8149.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84733080,84717080,84717050,84717098 INVOICE NO.:NC3068393, 087174521,087174522, 087174520,087174519 |
| 2025-05-01 |
NXGWOSACXZ77921 |
SCREEN SEMICONDUCTOR SOLUTIONSCO L |
31140.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-04-25 |
NXGWTYOCYM31450 |
TOKYO ELECTRON LIMITED |
230.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-04-09 |
NXGWTYOCWZ21585 |
TOKYO ELECTRON LIMITED |
5108.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, |
| 2025-03-31 |
CCLLTPES25142372 |
GUDENG PRECISION INDUSTRIAL CO LT |
718.0 kg |
|
EUV POD |
| 2025-03-22 |
CCLLHAMS25555547 |
IBM DEUTSCHLAND GMBH |
5361.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84733080,84717080,84717050,84717098 INVOICE NO.: NC3068336 |
| 2025-01-29 |
NXGWTYOCVC28383 |
TOKYO ELECTRON LIMITED |
228.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2025-01-28 |
AMIGL240602349A |
SHANGHAI KINGSING AUTO CO LTD |
240.0 kg |
845630
|
WIRE HARNESS CIRCULAR LABELING MACHINE KS-L115C AND ACCESSORIES CUSTOMIZED WIRE HARNESS FLAG LABELING MACHINE KSL130F AND ACCESSORIES |
| 2024-12-27 |
NXGWTYOCTP42192 |
TOKYO ELECTRON LIMITED |
106.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-27 |
CCLLHAMS24550416 |
IBM DEUTSCHLAND GMBH |
10403.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84733080,84717080,84717050,84717098 INVOICE NO.: 087174460 -087174463, 087174465, NC3068216 IT EQUIPMENTHS CODE: 84715000,84733080,84717080,84717050,84717098 INVOICE NO.: 087174460 -087174463, 087174465, NC3068216 |
| 2024-12-23 |
LPRO1263455 |
ADDVOLT S A |
1350.0 kg |
721913
|
3 PACKAGES SLAC AUTO PARTS IMO 9 UN 3481 |
| 2024-12-23 |
NXGWTYOCSS02204 |
TOKYO ELECTRON LIMITED |
20451.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-12-10 |
NXGWNGOCSW52400 |
MURATA MACHINERY LTD |
492.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-11-16 |
CCLLHAMS24547316 |
IBM DEUTSCHLAND GMBH |
10206.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84718000,84717050,84717098 INVOICE NO.: 087174438, 087174439, 087174441, 087174442,087174443, 087174444, 087174448, 087174447, 087174452,087174453, 087174454. |
| 2024-11-16 |
CCLLHAMS24548482 |
IBM DEUTSCHLAND GMBH |
8918.0 kg |
844151
|
WOODEN BOXESHS CODE: 844151010INVOICE NO.: NC3068154 |
| 2024-10-12 |
CCLLSYDS24129857 |
IBM AUSTRALIA C/O RICO LOGISTICS |
4.0 kg |
850650
|
BATTERY,LITHIUM ION,SECONDARY |
| 2024-10-11 |
CCLLTPES24138640 |
AIR LIQUIDE ELECTRONICS SYSTEMS ASI |
1730.0 kg |
930320
|
ETWCF-A01911_IBM CNSE, SLURRY PUMP STATION/ SLURRY PUMP STATIONETWCF-A01921_IBM CNSE, CHEMFLEX IC CMP/ CHEMFLEX IC CMPETWSC-A01131_IBM CNSE, SPARE Q/DS/ SPARE Q/DS |
| 2024-10-10 |
CCLLHAMS24544969 |
IBM DEUTSCHLAND GMBH |
5033.0 kg |
850699
|
IT EQUIPMENT |
| 2024-09-30 |
CMDUSG10292150 |
LAM RESEARCH SINGAPORE PTE LTD |
3611.0 kg |
293399
|
------------ TCNU6659963 DESCRIPTION---------CONFIG ASSY, FIB, JTS-S CONFIG,SPDB, L10 ODD/L6/L4 CONFIG,BRIDGE,JTS-S CONFIG, FIP, JTS-S CONFIG,GB L6 ASSY,PM 1-3-5 ,JTS-S CONFIG,GB L6 ASSY,PM 2-4-6,JTS-S KIT,SHIPPING,RF SPRT,L6,CE PO NO: 4700915137 THIS MASTER BILL COVERS FOLLOWING NON AUTOMATHOUSE BILL(S): SISS24104143 PLEASE USE THESE B/L NUMBER(S) FOR ISF LODGEMFREIGHT PREPAID FCL/FCL -------------GENERIC DESCRIPTION------------- |
| 2024-09-30 |
CCLLSISS24104143 |
LAM RESEARCH SINGAPORE PTE LTD |
3611.0 kg |
292145
|
CONFIG ASSY, FIB, JTS-SCONFIG,SPDB, L10 ODD/L6/L4CONFIG,BRIDGE,JTS-SCONFIG, FIP, JTS-SCONFIG,GB L6 ASSY,PM 1-3-5 ,JTS-SCONFIG,GB L6 ASSY,PM 2-4-6,JTS-SKIT,SHIPPING,RF SPRT,L6,CEPO NO: 4700915137 |
| 2024-09-30 |
CCLLSISS24104183 |
LAM RESEARCH SINGAPORE PTE LTD |
6115.0 kg |
293499
|
CONFIG, TM, SHIPPING LEVEL, 5W, EFEM CONFIG, SHIPPING LEVEL,VTM/UFA,PURCH ASSYCONFIG ASSY,FIB, JTS-SCONFIG,SPDB, L10 ODD/L6/L4CONFIG,B RIDGE,JTS-SCONFIG, FIP, JTS-SCONFIG,GB L6 ASSY,PM 1-3-5 ,JTS-SCONFIG,GB L6 ASSY,PM 2-4-6,JTS-SKIT,SHIPPING,RF SPRT,L6,CEPO NO: 4700915137 |
| 2024-08-22 |
CCLLHAMS24542692 |
IBM DEUTSCHLAND GMBH |
12522.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84733080,84717080,84717050,84717098 INVOICE NO.: 087174392,087174393,087174394,087174395,087174396,087174397,087174398 |
| 2024-07-28 |
CCLLJNBS24005009 |
IBM SOUTH AFRICA |
5167.0 kg |
|
MAINFRAMES |
| 2024-07-26 |
CCLLHAMS24539673 |
IBM DEUTSCHLAND GMBH |
8947.0 kg |
850699
|
IT EQUIPMENT |
| 2024-07-13 |
NEDFTYOCLE77634 |
TOKYO ELECTRON LIMITED |
36493.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-06-20 |
CCLLSYDS24127135 |
IBM AUSTRALIA LTD |
1999.0 kg |
901720
|
SERVER COMPUTER INVOICE# 23XU3020A |
| 2024-06-18 |
CCLLHAMS24538164 |
IBM DEUTSCHLAND GMBH |
11338.0 kg |
847150
|
IT EQUIPMENT HS CODE: 84715000, 84717098, 85176200 |
| 2024-06-09 |
CCLLBKKS24101409 |
FUJI ELECTRIC MANUFACTURING THAILA |
14000.0 kg |
854320
|
ASSEMBLY OF BSM IN FRU PACKAGE IBM FRU PN : 02AN313 DC-UPS SUBASSEMBLY PARTS BSM INVOICE NO. 90112862HS CODE : 854320GEODIS SCAC CODE : CCLLHOUSE BILL NO . BKKS24101409 ASSEMBLY OF BSM IN FRU PACKAGE IBM FRU PN : 02AN313 DC-UPS SUBASSEMBLY PARTS BSM INVOICE NO. 90112862HS CODE : 854320GEODIS SCAC CODE : CCLLHOUSE BILL NO . BKKS24101409 |
| 2024-06-05 |
CCLLHAMS24537022 |
IBM DEUTSCHLAND GMBH |
1208.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000, 84717000, 84717080, 84717098INVOICE NO.: 087174348, 087174347, 087174346, 087174345 |
| 2024-05-29 |
NEDFTYOCJN80720 |
TOKYO ELECTRON LIMITED |
42791.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-05-22 |
CCLLHAMS24535785 |
IBM DEUTSCHLAND GMBH |
14896.0 kg |
847170
441510
|
IT EQUIPMENTHS CODE: 84717050, 84717098, 84715000INVOICE NO.: 087174323, 087174324, 087174325, 087174326, 087174327, 087174328, 087174329, 087174330 BOX, WOODENHS CODE: 44151010INVOICE NO.: NC3067931 |
| 2024-05-19 |
CCLLBKKS24100039 |
FUJI ELECTRIC MANUFACTURING THAILA |
7000.0 kg |
950320
|
ASSEMBLY OF BSM IN FRU PACKAGE |
| 2024-05-15 |
CCLLHAMS24534682 |
IBM DEUTSCHLAND GMBH |
24015.0 kg |
847170
441510
|
WOODEN BOXESHS CODE: 44151010INVOICE NO.: NC3067916 WOODEN BOXESHS CODE: 44151010INVOICE NO.: NC3067915 STORAGE UNITSHS CODE: 84717098INVOICE NO.: 087174313 WOODEN BOXESHS CODE: 44151010INVOICE NO.: NC3067917 |
| 2024-05-08 |
NEDFTYOCJD61136 |
TOKYO ELECTRON LIMITED |
66993.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-04-03 |
CCLLHAMS24533083 |
IBM DEUTSCHLAND GMBH |
4789.0 kg |
441510
|
WOODEN CRATES AND BOXESHS CODE: 44151010INVOICE NO.: NC3067843 |
| 2024-04-01 |
NEDFTYOCHT24743 |
IBM JAPAN LTD |
1060.0 kg |
851719
|
TELEPHONE SETS, INCLUDING TELEPHONES FOR CELLULAR NETWORKS OR FOR OTHER WIRELESS NETWORKS;OTHER APPARATUS FOR THE TRANSMISSION OR RECE |
| 2024-03-27 |
CCLLBUDS24012678 |
IBM VAC |
5324.0 kg |
|
PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM PARTNUM |
| 2024-03-24 |
NEDFOSACGV51310 |
SCREEN SEMICONDUCTOR SOLUTIONSCO L |
20270.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-03-16 |
NEDFNGOCHL44574 |
MURATA MACHINERY LTD |
254.0 kg |
847110
|
AUTOMATIC DATA PROCESSING MACHINES AND UNITS THEREOF; MAGNETIC OR OPTICAL READERS, MACHINES FOR TRANSCRIBING DATA ONTO DATA MEDIA IN CO |
| 2024-03-13 |
CCLLHAMS24531017 |
IBM DEUTSCHLAND GMBH |
15902.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000INVOICE NO.:087174246, 087174247, 087174249, 087174250, 087174248, 087174251, 087174255, 087174256. |
| 2024-02-28 |
CCLLHAMS24528818 |
IBM DEUTSCHLAND GMBH |
9567.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84717080, 84717050,84747098 INVOICE NO.: 087174219,087174220,087174226,087174232,NC3067780,087174231,087174230,087174228,087174229,087174227. |
| 2024-02-15 |
NEDFTYOCFN84363 |
TOKYO ELECTRON LIMITED |
11914.0 kg |
846410
|
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
| 2024-02-09 |
CCLLHKGS24230143 |
FABRICATORS INTERNATIONAL LIMITED |
694.0 kg |
850650
|
LITHIUM METAL BATTERIES |
| 2024-02-07 |
CCLLHAMS23527659 |
IBM DEUTSCHLAND GMBH |
6085.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84717098, 44151010INVOICE NO.: NC3067757,087174204,087174203,087174202 |
| 2024-02-02 |
CCLLHAMS23527424 |
IBM DEUTSCHLAND GMBH |
3213.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000,84717098,84717080,84717050INVOICE NO.: 087174196,087174194,087174195,087174193,087174192,087174191,087174189 |
| 2024-02-01 |
CCLLHKGS23228301 |
FABRICATORS INTERNATIONAL LIMITED |
140.0 kg |
850650
|
LITHIUM ION BATTERIES |
| 2024-01-25 |
CCLLHAMS23526673 |
IBM DEUTSCHLAND GMBH |
6438.0 kg |
847150
|
IT EQUIPMENTHS CODE: 84715000, 84717050, 84717098, 84717080, 85285210, 84733080INVOICE NO.: 087174184,087174185,087174186,087174187,087174188,NC3067735 |
| 2024-01-12 |
CCLLHKGS23229338 |
FABRICATORS INTERNATIONAL LIMITED |
32.0 kg |
850650
|
LITHIUM METAL BATTERIES |