2024-12-28 |
JPANJPUSYKK08988 |
JSR CORP |
697.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND |
2024-12-17 |
JPANJPUSYKK08980 |
JSR CORP |
8976.0 kg |
591190
|
DIISOPENTHYL ETHER RESIN SOLUTION RESIN SOLUTION TETRACYCLOALKY ALCHOL COMPOUND ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUION PACKING MATERIAL PACKING MATERIAL |
2024-12-17 |
EGLV001400483598 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
8600.0 kg |
940430
|
JSR CMS SB 10PLTS=40DRUMS 1. JSR CMS-SB08 LOT NO. 4K231AX @20 DRUM 2. JSR CMS-SB08 LOT NO. 4K251AX @20 DRUM TSMC REEFER CONTAINER |
2024-12-12 |
JPANJPUSYKK08970 |
JSR CORP |
16386.0 kg |
730900
|
MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD |
2024-12-07 |
EGLV001400458780 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
24940.0 kg |
|
JSR CMS-WG25/JSR CMS-SB08/JSR CMS-WG31 JSR CMS-WG25/JSR CMS-SB08/JSR CMS-WG31 29PLTS=116DRUMS 1. JSR CMS-WG25 LOT NO. 4K111AV @12 DRUM 2. JSR CMS-SB08 LOT NO. 4K111AX @20 DRUM 3. JSR CMS-WG31 LOT NO. 4K083AY @12 DRUM 4. JSR CMS-WG31 LOT NO. 4K093AY @12 DRUM 5. JSR CMS-WG31 LOT NO. 4K113AY @12 DRUM 6. JSR CMS-WG31 LOT NO. 4K123AY @12 DRUM 7. JSR CMS-WG31 LOT NO. 4K133AY @12 DRUM 8. JSR CMS-WG31 LOT NO. 4K143AY @12 DRUM 9. JSR CMS-WG31 LOT NO. 4K153AY @12 DRUM TSMC REEFER CONTAINER |
2024-12-05 |
JPANJPUSYKK08955 |
JSR CORP |
7479.0 kg |
281420
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION METHYL 3-METHOXYPROPIONATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-11-30 |
JPANJPUSYKK08947 |
JSR CORP |
8602.0 kg |
291535
|
RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) ETHYL 3-ETHOXYPROPIONATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE FLUOROACRYLIC RESIN RAW MATERIAL ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION |
2024-11-29 |
EGLV001400452668 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
17200.0 kg |
|
JSR CMS WG 20PLTS=80DRUMS 1. JSR CMS-WG25 LOT NO. 4K011AV @12 DRUM 2. JSR CMS-WG25 LOT NO. 4K041AV @12 DRUM 3. JSR CMS-SB08 LOT NO. 4K041AX @20 DRUM 4. JSR CMS-WG31 LOT NO. 4K013AY @12 DRUM 5. JSR CMS-WG31 LOT NO. 4K043AY @12 DRUM 6. JSR CMS-WG31 LOT NO. 4K053AY @12 DRUM TSMC REEFER CONTAINER JSR CMS WG |
2024-11-25 |
JPANJPUSYKK08941 |
JSR CORP |
20371.0 kg |
281420
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-11-16 |
JPANJPUSYKK08934 |
JSR CORP |
8572.0 kg |
730900
|
CMP PAD DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION 1-METHOXY-2-PROPANOL RESIN SOLUTION |
2024-11-08 |
JPANJPUSYKK08928 |
JSR CORP |
3847.0 kg |
281420
|
RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION |
2024-10-24 |
JPANJPUSYKK08920 |
JSR CORP |
3845.0 kg |
380630
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION CARBAMIC ACID ESTER COMPOUND PACKING MATERIAL DIISOPENTYL ESTER ORGANIC SULFONIUM COMPOUND RESIN SOLUTION |
2024-10-19 |
JPANJPUSYKK08911 |
JSR CORP |
16155.0 kg |
291535
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION ETHYL 3-ETHOXYPROPIONATE ORGANIC SULFONIUM COMPOUND ALIPHATIC AMINE COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RAW MATERIAL |
2024-10-17 |
EGLV001400397403 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
8600.0 kg |
871494
|
JSR CMS WG 10PLTS=40DRUMS 1. JSR CMS-WG31 LOT NO. 4H193AY @8 DRUM 2. JSR CMS-WG31 LOT NO. 4H203AY @8 DRUM 3. JSR CMS-WG31 LOT NO. 4H213AY @12 DRUM 4. JSR CMS-WG31 LOT NO. 4H223AY @12 DRUM TSMC REEFER CONTAINER |
2024-10-14 |
JPANJPUSYKK08907 |
JSR CORP |
14508.0 kg |
730900
|
DIISOPENTYL ETHER DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER,(2S)- PACKING MATERIAL CMP PAD |
2024-10-14 |
MEDUAS830092 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE TETRAMENTHYL-AMMONIUM HYDR OXIDE SOLUTION CLASS 8 UN 1835 PG II |
2024-10-12 |
HITPHHSW00634126 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
2650.0 kg |
340590
|
POST CMP CLEANING SOLUTIONCLEANERHS CODE: 3405.9012DRUMS=4PLTSCLASS:8UN#1760 |
2024-10-08 |
EGLV001400386975 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
28380.0 kg |
292145
|
JSR CMS WG DRUM 33PLTS=132DRUMS 1.JSR CMS-WG25 @ 8DRUM LOT NO. 4H081AV 2.JSR CMS-WG25 @ 8DRUM LOT NO. 4H091AV 3.JSR CMS-WG31 @ 12DRUM LOT NO. 4H083AY 4.JSR CMS-WG31 @ 12DRUM LOT NO. 4H093AY 5.JSR CMS-WG31 @ 12DRUM LOT NO. 4H103AY 6.JSR CMS-WG31 @ 8DRUM LOT NO. 4H113AY 7.JSR CMS-SB08 @ 20DRUM LOT NO. 4H081AX 8.JSR CMS-SB08 @ 20DRUM LOT NO. 4H091AX 9.JSR CMS-SB08 @ 20DRUM LOT NO. 4H121AX 10.JSR CMS-SB08 @ 12DRUM LOT NO. 4H131AX TSMC REEFER CONTAINER JSR CMS WG DRUM |
2024-10-04 |
JPANJPUSYKK08893 |
JSR CORP |
7665.0 kg |
591190
|
RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) CARBOXIMIDE COMPOUND TETRACYCLOALKY ALCOHOL COMPOUND ORGANIC LODONIUM COMPOUND ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-10-02 |
EGLV001400378042 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
19780.0 kg |
871494
|
JSR CMS WG DRUM JSR CMS WG DRUM 23PLTS=92DRUMS 1.JSR CMS-WG25 @ 12DRUM LOT NO. 4H061AV 2.JSR CMS-WG25 @ 12DRUM LOT NO. 4H071AV 3.JSR CMS-WG31 @ 12DRUM LOT NO. 4H053AY 4.JSR CMS-WG31 @ 12DRUM LOT NO. 4H063AY 5.JSR CMS-WG31 @ 12DRUM LOT NO. 4H073AY 6.JSR CMS-SB08 @ 12DRUM LOT NO. 4H061AX 7.JSR CMS-SB08 @ 20DRUM LOT NO. 4H071AX TSMC REEFER CONTAINER |
2024-09-27 |
JPANJPUSYKK08882 |
JSR CORP |
2930.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION |
2024-09-15 |
EGLV001400343192 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
871494
|
JSR CMS WG DRUM 36PLTS=144DRUMS 1.JSR CMS-WG25 @ 12DRUM LOT NO. 4G141AV 2.JSR CMS-WG25 @ 12DRUM LOT NO. 4G151AV 3.JSR CMS-WG25 @ 8DRUM LOT NO. 4G161AV 4.JSR CMS-SB08 @ 20DRUM LOT NO. 4G161AX 5.JSR CMS-SB08 @ 20DRUM LOT NO. 4G171AX 6.JSR CMS-SB08 @ 24DRUM LOT NO. 4G081AX 7.JSR CMS-SB08 @ 24DRUM LOT NO. 4G091AX 8.JSR CMS-SB08 @ 24DRUM LOT NO. 4G101AX TSMC REEFER CONTAINER JSR CMS WG DRUM |
2024-09-09 |
JPANJPUSYKK08866 |
JSR CORP |
25563.0 kg |
291535
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETYL ESTER,(2S)-) PACKING MATERIAL ORGANIC SULFONIUM COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE 2-PROPANOL, 1-METHOXY-, 2-ACETATE CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION RAW MATERIAL |
2024-09-01 |
JPANJPUSYKK08851 |
JSR CORP |
20307.0 kg |
290911
|
DIISOPENTYL ETHER DIISOPENTYL ETHER RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PACKING MATERIAL IMIDAZOLE COMPOUND RESIN SOLUTION FLUOROARYLIC RESIN RAW MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE |
2024-08-24 |
JPANJPUSYKK08839 |
JSR CORP |
7219.0 kg |
591190
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION PACKING MATERIAL |
2024-08-24 |
EGLV001400319780 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
10320.0 kg |
846930
|
JSR CMS WG 12PLTS=48DRUMS JSR CMS-WG25 LOT NO. 4G021AV @12 DRUM JSR CMS-WG25 LOT NO. 4G031AV @12 DRUM JSR CMS-WG31 LOT NO. 4G013AY @12 DRUM JSR CMS-WG31 LOT NO. 4G023AY @12 DRUM TSMC REEFER CONTAINER |
2024-07-30 |
JPANJPUSYKK08815 |
JSR CORP |
14479.0 kg |
290942
|
PROPYLENE GLYCOL MONOMETHYL ETEHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND ORGANIC SULFONIUM COMPOUND RAW MATERIAL |
2024-07-24 |
EGLV001400237295 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
871494
|
JSR CMS SB JSR CMS SB 36PLTS=144DRUMS JSR CMS-SB08 LOT NO. 4E161AX @16 DRUM JSR CMS-SB08 LOT NO. 4E171AX @16 DRUM JSR CMS-SB08 LOT NO. 4E221AX @24 DRUM JSR CMS-WG25 LOT NO. 4E213AV @12 DRUM JSR CMS-WG25 LOT NO. 4E223AV @12 DRUM JSR CMS-WG31 LOT NO. 4E171AY @8 DRUM JSR CMS-WG31 LOT NO. 4E181AY @12 DRUM JSR CMS-WG31 LOT NO. 4E211AY @8 DRUM JSR CMS-WG31 LOT NO. 4E231AY @12 DRUM JSR CMS-WG31 LOT NO. 4E241AY @8 DRUM JSR CMS-WG31 LOT NO. 4E251AY @12 DRUM JSR CMS-WG31 LOT NO. 4E261AY @4 DRUM TSMC REEFER CONTAINER |
2024-07-19 |
JPANJPUSYKK08807 |
JSR CORP |
13629.0 kg |
591190
|
ORGANIC SULFONIUM COMPOUND CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PACKING MATERIAL |
2024-07-13 |
JPANJPUSYKK08798 |
JSR CORP |
8450.0 kg |
390710
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION FLUOROACRYLIC RESIN |
2024-07-04 |
JPANJPUSYKK08789 |
JSR CORP |
9307.0 kg |
730900
|
RESIN SOLUTION ORGANIC SULFONIUM COMPOUND PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-06-26 |
MEDUAS797267 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-06-25 |
JPANJPUSYKK08780 |
JSR CORP |
3295.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RAW MATERIAL |
2024-06-22 |
HITPHHSW00600806 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
5299.0 kg |
845110
|
POST CMP CLEANING SOLUTIONCLEANER |
2024-06-21 |
JPANJPUSYKK08779 |
JSR CORP |
10609.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-06-15 |
JPANJPUSYKK08767 |
JSR CORP |
19940.0 kg |
730900
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) METYL 3-METHOXYPROPIONATE PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) CYCLOHEXANONE TETRACYCLOALKY ALCOHOL COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD |
2024-06-13 |
EGLV001400179601 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
871494
|
JSR CMS-SB08 18PLTS=72DRUMS JSR CMS-SB08 LOT NO. 4D241AX @8 DRUM JSR CMS-SB08 LOT NO. 4D251AX @12 DRUM JSR CMS-WG25 LOT NO. 4D223AV@8 DRUM JSR CMS-WG25 LOT NO. 4D233AV@12 DRUM JSR CMS-WG31 LOT NO. 4D221AY@12 DRUM JSR CMS-WG31 LOT NO. 4D231AY@12 DRUM JSR CMS-WG31 LOT NO. 4D241AY@8 DRUM TSMC REEFER CONTAINER |
2024-05-30 |
JPANJPUSYKK08757 |
JSR CORP |
6199.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND |
2024-05-29 |
MEDUAS783549 |
RINCHEM ISRAEL LTD |
1200.0 kg |
294200
|
40 TOTE 31H1 IBC CONTAINI NG EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM HYDROXIDE S OLUTION UN NO 1 835 CLASS 8, PG II |
2024-05-25 |
JPANJPUSYKK08768 |
JSR CORP |
8840.0 kg |
290515
|
N-AMYL ALCOHOL AND PROPANOL |
2024-05-22 |
JPANJPUSYKK08752 |
JSR CORP |
28638.0 kg |
291535
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CYCLOHEXANONE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-05-18 |
HITPHHSW00587845 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
662.0 kg |
845110
|
POST CMP CLEANING SOLUTIONCLEANER |
2024-05-18 |
JPANJPUSYKK08756 |
JSR CORP |
6513.0 kg |
382541
|
ORGANIC ACID |
2024-05-13 |
EGLV001400133881 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
871494
|
JSR CMS-SB08/JSR CMS-WG25/JSR CMS-WG31 18PLTS=72DRUMS JSR CMS-SB08 LOT NO. 4C201AX @20 DRUM JSR CMS-SB08 LOT NO. 4C211AX @16 DRUM JSR CMS-WG25 LOT NO. 4C201AV@8 DRUM JSR CMS-WG25 LOT NO. 4C211AV@4 DRUM JSR CMS-WG31 LOT NO. 4C203AY@12 DRUM JSR CMS-WG31 LOT NO. 4C213AY@12 DRUM TSMC REEFER CONTAINER |
2024-05-09 |
JPANJPUSYKK08749 |
JSR CORP |
3213.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION |
2024-05-04 |
JPANJPUSYKK08743 |
JSR CORP |
8884.0 kg |
281420
|
ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-04-27 |
JPANJPUSYKK08736 |
JSR CORP |
7554.0 kg |
591190
|
CMP PAD PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) |
2024-04-20 |
JPANJPUSYKK08730 |
JSR CORP |
5249.0 kg |
281420
|
RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-04-17 |
MEDUAS764531 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-03-22 |
JPANJPUSYKK08707 |
JSR CORP |
20366.0 kg |
591190
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER, (2S) TETRACYCLOALKY ALCOHOL COMPOUND ORGANIC LODONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RAW MATERIAL PACKING MATERIAL PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE |