2024-08-24 |
JPANJPUSYKK08839 |
JSR CORP |
7219.0 kg |
591190
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION PACKING MATERIAL |
2024-08-24 |
EGLV001400319780 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
10320.0 kg |
846930
|
JSR CMS WG 12PLTS=48DRUMS JSR CMS-WG25 LOT NO. 4G021AV @12 DRUM JSR CMS-WG25 LOT NO. 4G031AV @12 DRUM JSR CMS-WG31 LOT NO. 4G013AY @12 DRUM JSR CMS-WG31 LOT NO. 4G023AY @12 DRUM TSMC REEFER CONTAINER |
2024-07-30 |
JPANJPUSYKK08815 |
JSR CORP |
14479.0 kg |
290942
|
PROPYLENE GLYCOL MONOMETHYL ETEHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND ORGANIC SULFONIUM COMPOUND RAW MATERIAL |
2024-07-24 |
EGLV001400237295 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
871494
|
JSR CMS SB JSR CMS SB 36PLTS=144DRUMS JSR CMS-SB08 LOT NO. 4E161AX @16 DRUM JSR CMS-SB08 LOT NO. 4E171AX @16 DRUM JSR CMS-SB08 LOT NO. 4E221AX @24 DRUM JSR CMS-WG25 LOT NO. 4E213AV @12 DRUM JSR CMS-WG25 LOT NO. 4E223AV @12 DRUM JSR CMS-WG31 LOT NO. 4E171AY @8 DRUM JSR CMS-WG31 LOT NO. 4E181AY @12 DRUM JSR CMS-WG31 LOT NO. 4E211AY @8 DRUM JSR CMS-WG31 LOT NO. 4E231AY @12 DRUM JSR CMS-WG31 LOT NO. 4E241AY @8 DRUM JSR CMS-WG31 LOT NO. 4E251AY @12 DRUM JSR CMS-WG31 LOT NO. 4E261AY @4 DRUM TSMC REEFER CONTAINER |
2024-07-19 |
JPANJPUSYKK08807 |
JSR CORP |
13629.0 kg |
591190
|
ORGANIC SULFONIUM COMPOUND CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PACKING MATERIAL |
2024-07-13 |
JPANJPUSYKK08798 |
JSR CORP |
8450.0 kg |
390710
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION FLUOROACRYLIC RESIN |
2024-07-04 |
JPANJPUSYKK08789 |
JSR CORP |
9307.0 kg |
730900
|
RESIN SOLUTION ORGANIC SULFONIUM COMPOUND PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-06-26 |
MEDUAS797267 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-06-25 |
JPANJPUSYKK08780 |
JSR CORP |
3295.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RAW MATERIAL |
2024-06-22 |
HITPHHSW00600806 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
5299.0 kg |
845110
|
POST CMP CLEANING SOLUTIONCLEANER |
2024-06-21 |
JPANJPUSYKK08779 |
JSR CORP |
10609.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-06-15 |
JPANJPUSYKK08767 |
JSR CORP |
19940.0 kg |
730900
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) METYL 3-METHOXYPROPIONATE PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) CYCLOHEXANONE TETRACYCLOALKY ALCOHOL COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD |
2024-06-13 |
EGLV001400179601 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
871494
|
JSR CMS-SB08 18PLTS=72DRUMS JSR CMS-SB08 LOT NO. 4D241AX @8 DRUM JSR CMS-SB08 LOT NO. 4D251AX @12 DRUM JSR CMS-WG25 LOT NO. 4D223AV@8 DRUM JSR CMS-WG25 LOT NO. 4D233AV@12 DRUM JSR CMS-WG31 LOT NO. 4D221AY@12 DRUM JSR CMS-WG31 LOT NO. 4D231AY@12 DRUM JSR CMS-WG31 LOT NO. 4D241AY@8 DRUM TSMC REEFER CONTAINER |
2024-05-30 |
JPANJPUSYKK08757 |
JSR CORP |
6199.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND |
2024-05-29 |
MEDUAS783549 |
RINCHEM ISRAEL LTD |
1200.0 kg |
294200
|
40 TOTE 31H1 IBC CONTAINI NG EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM HYDROXIDE S OLUTION UN NO 1 835 CLASS 8, PG II |
2024-05-25 |
JPANJPUSYKK08768 |
JSR CORP |
8840.0 kg |
290515
|
N-AMYL ALCOHOL AND PROPANOL |
2024-05-22 |
JPANJPUSYKK08752 |
JSR CORP |
28638.0 kg |
291535
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CYCLOHEXANONE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-05-18 |
HITPHHSW00587845 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
662.0 kg |
845110
|
POST CMP CLEANING SOLUTIONCLEANER |
2024-05-18 |
JPANJPUSYKK08756 |
JSR CORP |
6513.0 kg |
382541
|
ORGANIC ACID |
2024-05-13 |
EGLV001400133881 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
871494
|
JSR CMS-SB08/JSR CMS-WG25/JSR CMS-WG31 18PLTS=72DRUMS JSR CMS-SB08 LOT NO. 4C201AX @20 DRUM JSR CMS-SB08 LOT NO. 4C211AX @16 DRUM JSR CMS-WG25 LOT NO. 4C201AV@8 DRUM JSR CMS-WG25 LOT NO. 4C211AV@4 DRUM JSR CMS-WG31 LOT NO. 4C203AY@12 DRUM JSR CMS-WG31 LOT NO. 4C213AY@12 DRUM TSMC REEFER CONTAINER |
2024-05-09 |
JPANJPUSYKK08749 |
JSR CORP |
3213.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION |
2024-05-04 |
JPANJPUSYKK08743 |
JSR CORP |
8884.0 kg |
281420
|
ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-04-27 |
JPANJPUSYKK08736 |
JSR CORP |
7554.0 kg |
591190
|
CMP PAD PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) |
2024-04-20 |
JPANJPUSYKK08730 |
JSR CORP |
5249.0 kg |
281420
|
RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-04-17 |
MEDUAS764531 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-03-22 |
JPANJPUSYKK08707 |
JSR CORP |
20366.0 kg |
591190
|
RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER, (2S) TETRACYCLOALKY ALCOHOL COMPOUND ORGANIC LODONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RAW MATERIAL PACKING MATERIAL PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE |
2024-03-20 |
MEDUAS755299 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-03-17 |
MEDUAS750563 |
RINCHEM ISRAEL LTD |
1200.0 kg |
294200
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM HYDROXIDE S OLUTION UN NO 1 835 CLASS 8, PG II |
2024-03-16 |
JPANJPUSYKK08701 |
JSR CORP |
1311.0 kg |
281420
|
RESIN SOLUTION CMP PAD |
2024-03-07 |
JPANJPUSYKK08695 |
JSR CORP |
4832.0 kg |
730900
|
RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER N-AMYL METHYL KETONE PACKING MATERIAL CMP PAD |
2024-02-22 |
JPANJPUSYKK08683 |
JSR CORP |
10691.0 kg |
960629
|
RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER, (2S) DIISOPENTYL ETHER RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-02-20 |
EGLV001400003456 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
871494
|
JSR CMS-SB08,JSR CMS-WG25 18PLTS=72DRUMS JSR CMS-SB08 LOT NO. 3L091AX @20 DRUM JSR CMS-SB08 LOT NO. 3L101AX @16 DRUM JSR CMS-WG25 LOT NO. 3L033AV@8 DRUM JSR CMS-WG25 LOT NO. 3L041AV@4 DRUM JSR CMS-WG31 LOT NO. 3L083AY@8 DRUM JSR CMS-WG31 LOT NO. 3L093AY@8 DRUM JSR CMS-WG31 LOT NO. 3L101AY@8 DRUM TSMC REEFER CONTAINER |
2024-02-17 |
JPANJPUSYKK08670 |
JSR CORP |
23687.0 kg |
901190
|
IMIDAZOLE COMPOUND ORGANIC SULFONIUM COMPOUND ETHYL 3-ETHOXYPROPIONATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND RAW MATERIAL PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE |
2024-02-17 |
HITPHHSW00558913 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
1248.0 kg |
390710
|
RESIN SOLUTIONUN |
2024-02-11 |
MEDUAS737925 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-02-09 |
JPANJPUSYKK08667 |
JSR CORP |
2335.0 kg |
730900
|
PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER, (2S) PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER, (2S) RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-01-28 |
MEDUAS735572 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-01-24 |
JPANJPUSYKK08656 |
JSR CORP |
18782.0 kg |
291535
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION CYCLOHEXANONE TETRACYCLOALKY ALCOHOL COMPOUND ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND RAW MATERIAL PACKING MATERIAL |
2024-01-17 |
JPANJPUSYKK08652 |
JSR CORP |
12708.0 kg |
591190
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-01-11 |
EGLV001300551699 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
6020.0 kg |
760200
|
JSR CMS SB 7PLTS=28DRUMS JSR CMS-SB08 LOT NO. 3K051AX @12 DRUM JSR CMS-SB08 LOT NO. 3K131AX @16DRUM TSMC REEFER CONTAINER |
2024-01-10 |
JPANJPUSYKK08647 |
JSR CORP |
3646.0 kg |
390710
|
RESIN SOLUTION 1-METHOXY-2-PROPANOL FLUOROACRYLIC RESIN RESIN SOLUTION |
2024-01-05 |
HITPHHSW00537935 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
912.0 kg |
281420
|
POST CMP CLEANING SOLUTION |
2024-01-03 |
JPANJPUSYKK08636 |
JSR CORP |
13242.0 kg |
290942
|
PROPYLENE GLYCOL MONOMETHYL EHTER ACETATE RESIN SOLUTION RESIN SOLUTION |
2024-01-02 |
MEDUAS727157 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8,PG II |
2023-12-19 |
JPANJPUSYKK08630 |
JSR CORP |
15708.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND CYCLOHEXANONE 2-PROPANOL, 1-METHOXY-, 2ACETATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTHYL ETHER |
2023-12-18 |
JPANJPUSYKK08635 |
JSR CORP |
7929.0 kg |
290515
|
N-AMYL ALCOHOL AND PROPANOL |
2023-12-13 |
JPANJPUSYKK08620 |
JSR CORP |
4737.0 kg |
960629
|
RESIN SOLUTION CARBOXIMIDE COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND PACKING MATERIAL |
2023-12-09 |
JPANJPUSYKK08608 |
JSR CORP |
9450.0 kg |
591190
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2023-12-03 |
JPANJPUSYKK08594 |
JSR CORP |
17283.0 kg |
291612
|
PROPYLENE GLYCOL MONOMETHYL ACETATE TETRACYCLOALKY ALCHOL COMPOUND ORGANIC SULFONIUM COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION PACKING MATERIAL MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION CMP PAD |
2023-11-25 |
JPANJPUSYKK08590 |
JSR CORP |
812.0 kg |
960629
|
RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RAW MATERIAL |