2025-02-26 |
MEDUAS873696 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 IBC S TOTES OF UN NO 18 35 TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION, CLASS 8 , PG II, PLASTICS, NON-REM OVABLE HEAD (31H1) QTY OF 40 EMPTY WITH RESIDUE TOT ES. |
2025-02-14 |
EGLV001400568577 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
26660.0 kg |
281420
|
SILICA SLURRY SOLUTION 31PLTS=124DRUMS SILICA SLURRY SOLUTION . . REEFER CONTAINER SILICA SLURRY SOLUTION |
2025-02-13 |
JPANJPUSYKK09048 |
JSR CORP |
13276.0 kg |
591190
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION BISPHENOL DERIVATIVE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION PACKING MATERIAL DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION |
2025-02-09 |
EGLV001400580887 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
15480.0 kg |
281420
|
SILICA SLURRY SOLUTION 18PLTS=72DRUMS SILICA SLURRY SOLUTION . . REEFER CONTAINER |
2025-02-05 |
JPANJPUSYKK09040 |
JSR CORP |
1025.0 kg |
960629
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2025-01-28 |
EGLV001400548096 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
27520.0 kg |
281420
|
SILICA SLURRY SOLUTION SILICA SLURRY SOLUTION 32PLTS=128DRUMS SILICA SLURRY SOLUTION . . REEFER CONTAINER |
2025-01-27 |
MEDUAS864604 |
RINCHEM ISRAEL LTD |
5040.0 kg |
281512
|
40 IBC S TOTES OF UN NO 1 835 TETRAMENTHYL-A MMONIUM HYDROXIDE SOLUTION, CLASS 8, PG II, PLASTICS, NON-RE MOVABLE HEAD (31H1) QTY OF 40EMPTY WITH RESIDUE TOT ES. |
2025-01-21 |
JPANJPUSYKK09030 |
JSR CORP |
9041.0 kg |
960629
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RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2025-01-18 |
JPANJPUSYKK09023 |
JSR CORP |
10710.0 kg |
730900
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RESIN SOLUTION BISPHENOL DERIVATIVE RESIN SOLUTION BISPHENOL DERIVATIVE BISPHENOL DERIVATIVE BISPHENOL DERIVATIVE ETHYL 3-ETHOXYPROPIONATE RESIN SOLUTION CMP PAD RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND RAW MATERIAL |
2025-01-16 |
HITPHHSW00665770 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
1766.0 kg |
845110
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POST CMP CLEANING SOLUTIONCLEANER |
2025-01-11 |
EGLV001400516607 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30100.0 kg |
281420
|
SILICA SLURRY SOLUTION 35PLTS=140DRUMS SILICA SLURRY SOLUTION . . REEFER CONTAINER SILICA SLURRY SOLUTION |
2025-01-10 |
JPANJPUSYKK09010 |
JSR CORP |
14726.0 kg |
960629
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PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2025-01-07 |
MEDUAS857996 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE TETRAMENTHYL-AMMONIUM HYDR OXIDE SOLUTION CLASS 8 UN 1835 PG II |
2025-01-06 |
MEDUAS850876 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE TETRAMENTHYL-AMMONIUM HYDR OXIDE SOLUTION CLASS 8 UN 1835 PG II |
2025-01-04 |
EGLV001400512105 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
281420
|
SILICA SLURRY SOLUTION SILICA SLURRY SOLUTION 36PLTS=144DRUMS SILICA SLURRY SOLUTION . . REEFER CONTAINER |
2025-01-02 |
JPANJPUSYKK09000 |
JSR CORP |
15020.0 kg |
281420
|
PACKING MATERIAL DIISOPENTHYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTHYL ETHER ORGANIC SULFONIUM COMPOUND CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-12-28 |
JPANJPUSYKK08988 |
JSR CORP |
697.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND |
2024-12-17 |
EGLV001400483598 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
8600.0 kg |
940430
|
JSR CMS SB 10PLTS=40DRUMS 1. JSR CMS-SB08 LOT NO. 4K231AX @20 DRUM 2. JSR CMS-SB08 LOT NO. 4K251AX @20 DRUM TSMC REEFER CONTAINER |
2024-12-17 |
JPANJPUSYKK08980 |
JSR CORP |
8976.0 kg |
591190
|
DIISOPENTHYL ETHER RESIN SOLUTION RESIN SOLUTION TETRACYCLOALKY ALCHOL COMPOUND ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUION PACKING MATERIAL PACKING MATERIAL |
2024-12-12 |
JPANJPUSYKK08970 |
JSR CORP |
16386.0 kg |
730900
|
MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD |
2024-12-07 |
EGLV001400458780 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
24940.0 kg |
|
JSR CMS-WG25/JSR CMS-SB08/JSR CMS-WG31 JSR CMS-WG25/JSR CMS-SB08/JSR CMS-WG31 29PLTS=116DRUMS 1. JSR CMS-WG25 LOT NO. 4K111AV @12 DRUM 2. JSR CMS-SB08 LOT NO. 4K111AX @20 DRUM 3. JSR CMS-WG31 LOT NO. 4K083AY @12 DRUM 4. JSR CMS-WG31 LOT NO. 4K093AY @12 DRUM 5. JSR CMS-WG31 LOT NO. 4K113AY @12 DRUM 6. JSR CMS-WG31 LOT NO. 4K123AY @12 DRUM 7. JSR CMS-WG31 LOT NO. 4K133AY @12 DRUM 8. JSR CMS-WG31 LOT NO. 4K143AY @12 DRUM 9. JSR CMS-WG31 LOT NO. 4K153AY @12 DRUM TSMC REEFER CONTAINER |
2024-12-05 |
JPANJPUSYKK08955 |
JSR CORP |
7479.0 kg |
281420
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION METHYL 3-METHOXYPROPIONATE RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL |
2024-11-30 |
JPANJPUSYKK08947 |
JSR CORP |
8602.0 kg |
291535
|
RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) ETHYL 3-ETHOXYPROPIONATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE FLUOROACRYLIC RESIN RAW MATERIAL ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION |
2024-11-29 |
EGLV001400452668 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
17200.0 kg |
|
JSR CMS WG 20PLTS=80DRUMS 1. JSR CMS-WG25 LOT NO. 4K011AV @12 DRUM 2. JSR CMS-WG25 LOT NO. 4K041AV @12 DRUM 3. JSR CMS-SB08 LOT NO. 4K041AX @20 DRUM 4. JSR CMS-WG31 LOT NO. 4K013AY @12 DRUM 5. JSR CMS-WG31 LOT NO. 4K043AY @12 DRUM 6. JSR CMS-WG31 LOT NO. 4K053AY @12 DRUM TSMC REEFER CONTAINER JSR CMS WG |
2024-11-25 |
JPANJPUSYKK08941 |
JSR CORP |
20371.0 kg |
281420
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-11-16 |
JPANJPUSYKK08934 |
JSR CORP |
8572.0 kg |
730900
|
CMP PAD DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION 1-METHOXY-2-PROPANOL RESIN SOLUTION |
2024-11-08 |
JPANJPUSYKK08928 |
JSR CORP |
3847.0 kg |
281420
|
RESIN SOLUTION PROPANOIC ACID,2-HYDROXY-,ETHYL ESTER,(2S)-) CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION |
2024-10-24 |
JPANJPUSYKK08920 |
JSR CORP |
3845.0 kg |
380630
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION CARBAMIC ACID ESTER COMPOUND PACKING MATERIAL DIISOPENTYL ESTER ORGANIC SULFONIUM COMPOUND RESIN SOLUTION |
2024-10-19 |
JPANJPUSYKK08911 |
JSR CORP |
16155.0 kg |
291535
|
PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION ETHYL 3-ETHOXYPROPIONATE ORGANIC SULFONIUM COMPOUND ALIPHATIC AMINE COMPOUND RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RAW MATERIAL |
2024-10-17 |
EGLV001400397403 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
8600.0 kg |
871494
|
JSR CMS WG 10PLTS=40DRUMS 1. JSR CMS-WG31 LOT NO. 4H193AY @8 DRUM 2. JSR CMS-WG31 LOT NO. 4H203AY @8 DRUM 3. JSR CMS-WG31 LOT NO. 4H213AY @12 DRUM 4. JSR CMS-WG31 LOT NO. 4H223AY @12 DRUM TSMC REEFER CONTAINER |
2024-10-14 |
MEDUAS830092 |
RINCHEM ISRAEL LTD |
5040.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE TETRAMENTHYL-AMMONIUM HYDR OXIDE SOLUTION CLASS 8 UN 1835 PG II |
2024-10-14 |
JPANJPUSYKK08907 |
JSR CORP |
14508.0 kg |
730900
|
DIISOPENTYL ETHER DIISOPENTYL ETHER RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETHYL ESTER,(2S)- PACKING MATERIAL CMP PAD |
2024-10-12 |
HITPHHSW00634126 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
2650.0 kg |
340590
|
POST CMP CLEANING SOLUTIONCLEANERHS CODE: 3405.9012DRUMS=4PLTSCLASS:8UN#1760 |
2024-10-08 |
EGLV001400386975 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
28380.0 kg |
292145
|
JSR CMS WG DRUM 33PLTS=132DRUMS 1.JSR CMS-WG25 @ 8DRUM LOT NO. 4H081AV 2.JSR CMS-WG25 @ 8DRUM LOT NO. 4H091AV 3.JSR CMS-WG31 @ 12DRUM LOT NO. 4H083AY 4.JSR CMS-WG31 @ 12DRUM LOT NO. 4H093AY 5.JSR CMS-WG31 @ 12DRUM LOT NO. 4H103AY 6.JSR CMS-WG31 @ 8DRUM LOT NO. 4H113AY 7.JSR CMS-SB08 @ 20DRUM LOT NO. 4H081AX 8.JSR CMS-SB08 @ 20DRUM LOT NO. 4H091AX 9.JSR CMS-SB08 @ 20DRUM LOT NO. 4H121AX 10.JSR CMS-SB08 @ 12DRUM LOT NO. 4H131AX TSMC REEFER CONTAINER JSR CMS WG DRUM |
2024-10-04 |
JPANJPUSYKK08893 |
JSR CORP |
7665.0 kg |
591190
|
RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) CARBOXIMIDE COMPOUND TETRACYCLOALKY ALCOHOL COMPOUND ORGANIC LODONIUM COMPOUND ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION PACKING MATERIAL PACKING MATERIAL |
2024-10-02 |
EGLV001400378042 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
19780.0 kg |
871494
|
JSR CMS WG DRUM JSR CMS WG DRUM 23PLTS=92DRUMS 1.JSR CMS-WG25 @ 12DRUM LOT NO. 4H061AV 2.JSR CMS-WG25 @ 12DRUM LOT NO. 4H071AV 3.JSR CMS-WG31 @ 12DRUM LOT NO. 4H053AY 4.JSR CMS-WG31 @ 12DRUM LOT NO. 4H063AY 5.JSR CMS-WG31 @ 12DRUM LOT NO. 4H073AY 6.JSR CMS-SB08 @ 12DRUM LOT NO. 4H061AX 7.JSR CMS-SB08 @ 20DRUM LOT NO. 4H071AX TSMC REEFER CONTAINER |
2024-09-27 |
JPANJPUSYKK08882 |
JSR CORP |
2930.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION |
2024-09-15 |
EGLV001400343192 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
871494
|
JSR CMS WG DRUM 36PLTS=144DRUMS 1.JSR CMS-WG25 @ 12DRUM LOT NO. 4G141AV 2.JSR CMS-WG25 @ 12DRUM LOT NO. 4G151AV 3.JSR CMS-WG25 @ 8DRUM LOT NO. 4G161AV 4.JSR CMS-SB08 @ 20DRUM LOT NO. 4G161AX 5.JSR CMS-SB08 @ 20DRUM LOT NO. 4G171AX 6.JSR CMS-SB08 @ 24DRUM LOT NO. 4G081AX 7.JSR CMS-SB08 @ 24DRUM LOT NO. 4G091AX 8.JSR CMS-SB08 @ 24DRUM LOT NO. 4G101AX TSMC REEFER CONTAINER JSR CMS WG DRUM |
2024-09-09 |
JPANJPUSYKK08866 |
JSR CORP |
25563.0 kg |
291535
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PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE CMP PAD MULTIFUNCTIONAL ACRYLATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-, ETYL ESTER,(2S)-) PACKING MATERIAL ORGANIC SULFONIUM COMPOUND PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE 2-PROPANOL, 1-METHOXY-, 2-ACETATE CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION RAW MATERIAL |
2024-09-01 |
JPANJPUSYKK08851 |
JSR CORP |
20307.0 kg |
290911
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DIISOPENTYL ETHER DIISOPENTYL ETHER RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) PACKING MATERIAL IMIDAZOLE COMPOUND RESIN SOLUTION FLUOROARYLIC RESIN RAW MATERIAL PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE |
2024-08-24 |
JPANJPUSYKK08839 |
JSR CORP |
7219.0 kg |
591190
|
PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION ORGANIC SULFONIUM COMPOUND ORGANIC SULFONIUM COMPOUND RESIN SOLUTION PACKING MATERIAL |
2024-08-24 |
EGLV001400319780 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
10320.0 kg |
846930
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JSR CMS WG 12PLTS=48DRUMS JSR CMS-WG25 LOT NO. 4G021AV @12 DRUM JSR CMS-WG25 LOT NO. 4G031AV @12 DRUM JSR CMS-WG31 LOT NO. 4G013AY @12 DRUM JSR CMS-WG31 LOT NO. 4G023AY @12 DRUM TSMC REEFER CONTAINER |
2024-07-30 |
JPANJPUSYKK08815 |
JSR CORP |
14479.0 kg |
290942
|
PROPYLENE GLYCOL MONOMETHYL ETEHER ACETATE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION CARBOXIMIDE COMPOUND ORGANIC SULFONIUM COMPOUND RAW MATERIAL |
2024-07-24 |
EGLV001400237295 |
JSR ELECTRONIC MATERIALS TAIWAN CO LTD |
30960.0 kg |
871494
|
JSR CMS SB JSR CMS SB 36PLTS=144DRUMS JSR CMS-SB08 LOT NO. 4E161AX @16 DRUM JSR CMS-SB08 LOT NO. 4E171AX @16 DRUM JSR CMS-SB08 LOT NO. 4E221AX @24 DRUM JSR CMS-WG25 LOT NO. 4E213AV @12 DRUM JSR CMS-WG25 LOT NO. 4E223AV @12 DRUM JSR CMS-WG31 LOT NO. 4E171AY @8 DRUM JSR CMS-WG31 LOT NO. 4E181AY @12 DRUM JSR CMS-WG31 LOT NO. 4E211AY @8 DRUM JSR CMS-WG31 LOT NO. 4E231AY @12 DRUM JSR CMS-WG31 LOT NO. 4E241AY @8 DRUM JSR CMS-WG31 LOT NO. 4E251AY @12 DRUM JSR CMS-WG31 LOT NO. 4E261AY @4 DRUM TSMC REEFER CONTAINER |
2024-07-19 |
JPANJPUSYKK08807 |
JSR CORP |
13629.0 kg |
591190
|
ORGANIC SULFONIUM COMPOUND CYCLOHEXANONE RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PACKING MATERIAL RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION PACKING MATERIAL |
2024-07-13 |
JPANJPUSYKK08798 |
JSR CORP |
8450.0 kg |
390710
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION FLUOROACRYLIC RESIN |
2024-07-04 |
JPANJPUSYKK08789 |
JSR CORP |
9307.0 kg |
730900
|
RESIN SOLUTION ORGANIC SULFONIUM COMPOUND PACKING MATERIAL RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION PROPANOIC ACID, 2-HYDROXY-,ETHYL ESTER,(2S)-) RESIN SOLUTION RESIN SOLUTION CMP PAD |
2024-06-26 |
MEDUAS797267 |
RINCHEM ISRAEL LTD |
1200.0 kg |
310230
|
40 TOTE 31H1 IBC CONTAININ G EACH EMPTY WITH RESIDUE OF TETRAMENTHYL-AMMONIUM H YDROXIDE SOLUTION UN NO 18 35 CLASS 8, PG II |
2024-06-25 |
JPANJPUSYKK08780 |
JSR CORP |
3295.0 kg |
281420
|
RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION RESIN SOLUTION DIISOPENTYL ETHER ORGANIC SULFONIUM COMPOUND RESIN SOLUTION RAW MATERIAL |
2024-06-22 |
HITPHHSW00600806 |
JSR ELECTRONIC MATERIALS TAIWAN CO |
5299.0 kg |
845110
|
POST CMP CLEANING SOLUTIONCLEANER |