| Shipment Reliability and Frequency | Volume of Goods |
|---|---|
| Avg. Shipments per Month: 0.50 | Average TEU per month: 0.75 |
| Active Months: 5 | Average TEU per Shipment: 1.29 |
| Shipment Frequency Std. Dev.: 0.76 |
| Company Name | Shipments |
|---|---|
| SCIENTECH CORP | 2 shipments |
| SUHOU BETPAK NEW MATERIAL TECHNOLOGY CO LTD | 2 shipments |
| SUZHOU BETPAK NEW MATERIAL TECHNOLO | 2 shipments |
| XI AN ESWIN MATERIAL TECHNOLOGY CO | 2 shipments |
| ZING SEMICONDUCTOR CORP | 2 shipments |
| HANGZHOU SEMICONDUCTOR WAFER CO LT | 1 shipments |
| HS Code | Shipments |
|---|---|
| 720250 Ferro-alloys : Ferro-alloys; ferro-silico-chromium | 5 shipments |
| 842330 Weighing machines; excluding balances of a sensitivity of 5cg or better, including weight operated counting or checking machines and weights of all kinds : Weighing machines; constant weight scales and scales for discharging a predetermined weight of material into a bag or container, including hopper scales | 3 shipments |
| 842119 Centrifuges, including centrifugal dryers; filtering or purifying machinery and apparatus for liquids or gases : Centrifuges; n.e.c. in heading no. 8421, including centrifugal dryers (but not clothes-dryers) | 2 shipments |
| 741022 Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15mm : Copper; foil, backed with paper, paperboard, plastics or similar backing material, of a thickness (excluding any backing) not exceeding 0.15mm, of copper alloys | 1 shipments |
| Arrival Date | Bill Of Lading | Shipper | Weight | HS Code | Description |
|---|---|---|---|---|---|
| 2024-07-27 | DMERDFS067176313 | XI AN ESWIN MATERIAL TECHNOLOGY CO | 2957.0 kg | 720250 | SILICON WAFER |
| 2024-06-08 | DMERDFS012114910 | SCIENTECH CORP | 1170.0 kg | 842119 | 12 RECLAIM WAFER - MECHANICAL WAFER . |
| 2024-06-01 | DMERDFS012114739 | SCIENTECH CORP | 1170.0 kg | 842119 | 12 RECLAIM WAFER - MECHANICAL WAFER - CU . |
| 2024-04-16 | DMERDFS067173730 | XI AN ESWIN MATERIAL TECHNOLOGY CO | 929.0 kg | 720250 | SILICON WAFER |
| 2024-04-16 | DMERDFS067173732 | ZING SEMICONDUCTOR CORP | 282.0 kg | 720250 | SILICON WAFER |
| 2024-03-07 | DMERDFS715005518 | SUZHOU BETPAK NEW MATERIAL TECHNOLO | 1615.0 kg | 842330 | ALUMINIUM FOIL BAG PE BAG |
| 2024-01-11 | DMERDFS715005354 | SUHOU BETPAK NEW MATERIAL TECHNOLOGY CO LTD | 825.0 kg | 741022 | ALUMINIUM FOIL BAG |
| 2023-10-01 | DMERDFS715004892 | SUHOU BETPAK NEW MATERIAL TECHNOLOGY CO LTD | 2313.0 kg | 842330 | ALUMINIUM FOIL BAG PE BAG |
| 2023-02-08 | DMERDFS067163183 | ZING SEMICONDUCTOR CORP | 1440.0 kg | 720250 | SILICON WAFER |
| 2021-09-01 | DMERDFS072007274 | HANGZHOU SEMICONDUCTOR WAFER CO LT | 1618.0 kg | 720250 | SILICON WAFER |
| 2021-01-09 | DMERDFS715001404 | SUZHOU BETPAK NEW MATERIAL TECHNOLO | 2095.0 kg | 842330 | ALUMINUM FOIL BAG PE BAG |