| Shipment Reliability and Frequency | Volume of Goods |
|---|---|
| Avg. Shipments per Month: 2.00 | Average TEU per month: 3.10 |
| Active Months: 11 | Average TEU per Shipment: 1.33 |
| Shipment Frequency Std. Dev.: 1.71 |
| Company Name | Shipments |
|---|---|
| FUTURE ELECTRONICS | 47 shipments |
| EMC CORP | 8 shipments |
| DIGI KEY CORP | 6 shipments |
| BOLD RENEWABLES LLC | 4 shipments |
| DELL EMC | 4 shipments |
| BOYD CORP | 2 shipments |
| EMC CHAMPAGNE HUB | 2 shipments |
| DANFOSS | 1 shipments |
| FUTURE ELECTRONICS DISTRIBUTION | 1 shipments |
| HS Code | Shipments |
|---|---|
| 251319 Pumice stone; emery; natural corundum, natural garnet and other natural abrasives, whether or not heat treated | 72 shipments |
| 847330 Machinery; parts and accessories (other than covers, carrying cases and the like) of the machines of heading no. 8471 | 2 shipments |
| 850134 Electric motors and generators; DC, of an output exceeding 375kW | 1 shipments |
| Arrival Date | Bill Of Lading | Consignee | Weight | HS Code | Description |
|---|---|---|---|---|---|
| 2024-12-20 | DMALHKGC37608 | FUTURE ELECTRONICS | 1002.0 kg | 251319 | HEAT SINK |
| 2024-12-14 | DMALSZXC70369 | EMC CORP | 428.0 kg | 251319 | HEAT SINK |
| 2024-12-06 | DMALHKGC36337 | FUTURE ELECTRONICS | 173.0 kg | 251319 | HEAT SINK |
| 2024-11-28 | DMALHKGC35301 | FUTURE ELECTRONICS | 323.0 kg | 251319 | HEAT SINK |
| 2024-11-28 | DMALHKGC35357 | FUTURE ELECTRONICS | 189.0 kg | 251319 | HEAT SINK |
| 2024-11-25 | DMALSZXC66782 | EMC CORP | 141.0 kg | 251319 | HEAT SINK |
| 2024-11-22 | DMALSZXC68122 | DANFOSS | 581.0 kg | 251319 | HEAT SINK |
| 2024-11-20 | DMALSZXC66169 | EMC CORP | 205.0 kg | 251319 | HEAT SINK |
| 2024-09-10 | DMALSZXC58057 | DELL EMC | 735.0 kg | 251319 | HEAT SINK |
| 2024-07-03 | TXSLSPMYAN240609 | DIGI KEY CORP | 2049.0 kg | 850134 | 175CTNS=7PLTS DC FAN |
| 2024-06-18 | TXSLSPMYAN240515 | DIGI KEY CORP | 415.0 kg | 251319 | 40CTNS=2PLTS HEAT SINK |
| 2024-06-17 | TXSLSPMYAN240601 | DIGI KEY CORP | 610.0 kg | 251319 | 63CTNS=2PLTS HEAT SINK |
| 2024-05-31 | TXSLSPMHKG240506 | DIGI KEY CORP | 311.0 kg | 251319 | 39CTNS=1PLT HEAT SINK |
| 2024-05-22 | DMALHKGC21299 | EMC CHAMPAGNE HUB | 176.0 kg | 251319 | HEAT SINK |
| 2024-05-05 | TXSLSPMYAN240417 | DIGI KEY CORP | 307.0 kg | 251319 | 30CTNS=2PLTS HEAT SINK |
| 2024-05-02 | PUSJHKGLGBO01097 | FUTURE ELECTRONICS | 2908.0 kg | 251319 | HEAT SINK |
| 2024-04-27 | PUSJHKGLAXO00933 | FUTURE ELECTRONICS | 827.0 kg | 251319 | HEAT SINK |
| 2024-03-27 | PUSJHKGLAXO00569 | FUTURE ELECTRONICS | 979.0 kg | 251319 | HEAT SINK |
| 2024-02-28 | PUSJHKGLAXO00260 | FUTURE ELECTRONICS | 1065.0 kg | 251319 | HEAT SINK |
| 2024-02-17 | DMALSZXC32350 | DELL EMC | 187.0 kg | 251319 | HEAT SINK |
| 2024-02-13 | PUSJHKGLAXO00131 | FUTURE ELECTRONICS | 433.0 kg | 251319 | HEAT SINK |
| 2024-02-02 | DMALSZXC30611 | DELL EMC | 186.0 kg | 847330 | HEAT SINK HS:8473305100 |
| 2024-01-30 | DMALSZXC29641 | EMC CORP | 97.0 kg | 847330 | HEAT SINK HS:8473305100 |
| 2024-01-17 | DMALHKGC08063 | EMC CHAMPAGNE HUB | 156.0 kg | 251319 | HEAT SINK |
| 2024-01-07 | PUSJHKGLAXN03810 | FUTURE ELECTRONICS | 1312.0 kg | 251319 | HEAT SINK |
| 2024-01-07 | PUSJHKGLAXN03811 | FUTURE ELECTRONICS | 83.0 kg | 251319 | HEAT SINK |
| 2023-12-16 | PUSJHKGLAXN03511 | FUTURE ELECTRONICS | 2047.0 kg | 251319 | HEAT SINK |
| 2023-12-09 | PUSJHKGLAXN03437 | FUTURE ELECTRONICS | 169.0 kg | 251319 | HEAT SINK |
| 2023-11-28 | PUSJHKGLAXN03274 | FUTURE ELECTRONICS | 1418.0 kg | 251319 | HEAT SINK |
| 2023-11-28 | DMALHKGC03625 | BOLD RENEWABLES LLC | 1268.0 kg | 251319 | HEAT SINK |
| 2023-11-07 | PUSJHKGLAXN03043 | FUTURE ELECTRONICS | 112.0 kg | 251319 | HEAT SINK |
| 2023-11-03 | PUSJHKGLGBN03130 | FUTURE ELECTRONICS | 91.0 kg | 251319 | HEAT SINK |
| 2023-10-07 | PUSJHKGLAXN02756 | FUTURE ELECTRONICS | 115.0 kg | 251319 | HEAT SINK |
| 2023-09-23 | DMALHKGB95147 | EMC CORP | 270.0 kg | 251319 | HEAT SINK |
| 2023-09-12 | PUSJHKGLAXN02457 | FUTURE ELECTRONICS | 1249.0 kg | 251319 | HEAT SINK |
| 2023-09-05 | PUSJHKGLAXN02331 | FUTURE ELECTRONICS | 560.0 kg | 251319 | HEAT SINK |
| 2023-08-11 | DMALSZXC13264 | BOLD RENEWABLES LLC | 1269.0 kg | 251319 | HEAT SINK |
| 2023-08-06 | PUSJHKGLGBN02019 | FUTURE ELECTRONICS | 2429.0 kg | 251319 | HEAT SINK |
| 2023-07-30 | PUSJHKGLAXN01909 | FUTURE ELECTRONICS | 427.0 kg | 251319 | HEAT SINK |
| 2023-07-20 | PUSJHKGLAXN01762 | FUTURE ELECTRONICS | 571.0 kg | 251319 | HEAT SINK |
| 2023-07-20 | PUSJHKGLAXN01761 | FUTURE ELECTRONICS | 1147.0 kg | 251319 | HEAT SINK |
| 2023-07-06 | PUSJHKGLAXN01665 | FUTURE ELECTRONICS | 443.0 kg | 251319 | HEAT SINK |
| 2023-06-21 | PUSJHKGLAXN01420 | FUTURE ELECTRONICS | 174.0 kg | 251319 | HEAT SINK |
| 2023-06-08 | DMALSZXC07757 | BOYD CORP | 5285.0 kg | 251319 | HEAT SINK |
| 2023-05-25 | PUSJHKGLAXN01185 | FUTURE ELECTRONICS | 1018.0 kg | 251319 | HEAT SINK |
| 2023-05-04 | DMALSZXC04676 | BOYD CORP | 4207.0 kg | 251319 | HEAT SINK |
| 2023-04-17 | PUSJHKGLGBN00734 | FUTURE ELECTRONICS | 593.0 kg | 251319 | HEAT SINK |
| 2023-03-24 | PUSJHKGLGBN00512 | FUTURE ELECTRONICS | 1085.0 kg | 251319 | HEAT SINK |
| 2023-03-22 | PUSJHKGLGBN00428 | FUTURE ELECTRONICS | 122.0 kg | 251319 | HEAT SINK |
| 2023-03-10 | DMALSZXB97507 | BOLD RENEWABLES LLC | 1163.0 kg | 251319 | HEAT SINK |