2024-05-22 |
NEDFTYOCKK37256 |
PURE WAFER |
486.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
2023-12-19 |
NEDFTYOCES85363 |
PURE WAFER |
497.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELEC |
2023-12-13 |
AJLDJ302963201 |
PURE WAFER INC |
2203.0 kg |
854221
|
SILICON WAFERS, NOT-HAZARDOUS . . . |
2023-08-18 |
NEDFTYOCAS17244 |
PURE WAFER |
502.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-08-01 |
AJLDJ302885901 |
PURE WAFER INC |
1246.0 kg |
854221
|
(60 CARTONS) SILICON WAFERS, NOT-HAZARDOUS HS. . |
2023-06-25 |
AJLDJ302859301 |
PURE WAFER INC |
3454.0 kg |
854221
|
SILICON WAFERS, NOT-HAZARDOUS HS CODE . . . |
2023-06-17 |
NEDFTYOBYW82093 |
PURE WAFER |
480.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-03-30 |
NEDFTYOBWF76654 |
PURE WAFER |
3364.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-02-24 |
NEDFTYOBVR26374 |
PURE WAFER |
679.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-01-30 |
NEDFTYOBTG71290 |
PURE WAFER |
3403.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-01-13 |
NEDFTYOBTG71113 |
PURE WAFER |
784.0 kg |
391990
|
PLATES, SHEETS, PLASTICS, SELF-ADHESIVE |
2023-01-09 |
NEDFTYOBSJ28421 |
PURE WAFER |
481.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-12-09 |
NEDFTYOBRM54716 |
PURE WAFER |
3448.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-11-25 |
SHPT26860883 |
PURE WAFER INC |
528.0 kg |
381800
|
12 INCH SILICON WAFER HS CODE:3818.00 |
2022-10-25 |
YATIYGLTYO083638 |
PURE WAFER |
509.0 kg |
720250
|
12 INCH SILICON WAFER |
2022-10-18 |
KWEO114047075294 |
PURE WAFER INC |
3390.0 kg |
720250
|
SILICON WAFER (3818.00) |
2022-10-17 |
ECUWTYONYC04360 |
SILICON MATERIALS INC |
542.0 kg |
381800
|
SILICON WAFER HS CODE: 3818.00 |
2022-09-29 |
YATIYGLTYO083760 |
SILICON MATERIALS INC |
634.0 kg |
854221
|
8 INCH SILICON WAFER |
2022-09-16 |
NEDFTYOBNE82545 |
PURE WAFER |
518.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-06-24 |
NEDFTYOBKD78786 |
PURE WAFER |
535.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-04-18 |
NEDFTYOBHL70955 |
PURE WAFER |
939.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-02-16 |
NEDFTYOBFG52186 |
PURE WAFER |
1028.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-02-08 |
NEDFTYOBES65875 |
PURE WAFER |
1330.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-01-26 |
NEDFTYOBEM04040 |
PURE WAFER |
1540.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS |
2022-01-10 |
NEDFTYOBDV30994 |
PURE WAFER |
950.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2022-01-05 |
NEDFTYOBEM03675 |
PURE WAFER |
1150.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2021-12-21 |
NEDFTYOBDV30913 |
PURE WAFER |
1065.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2021-12-02 |
VHFLTYOTN2128784 |
PURE WAFER |
893.0 kg |
381800
|
12 INCH SILICON WAFER HS CODE 381800 |
2021-11-17 |
NEDFTYOBCX87381 |
PURE WAFER |
950.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2021-11-10 |
NEDFTYOBCX87086 |
PURE WAFER |
1159.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2021-10-02 |
NEDFTYOBCB72215 |
PURE WAFER |
1558.0 kg |
381800
|
CHEMICAL ELEMENTS DOPED, USED IN ELECTRONICS,DISCS WAFERS |
2021-09-09 |
DMALTYOA26847 |
PURE WAFER |
2778.0 kg |
720250
|
SILICON WAFER |
2021-08-26 |
CHKMKHKG21071444 |
A 1 SILICON INC |
85.0 kg |
854221
|
SILICON WAFERS . . . . . |
2021-08-25 |
ECUWTYOSFO00883 |
PURE WAFER |
867.0 kg |
381800
|
SILICON WAFER HS CODE 381800 |
2021-07-10 |
DMALTYOA24908 |
PURE WAFER |
4132.0 kg |
720250
|
SILICON WAFER |
2021-07-07 |
VHFLTYOTN2128258 |
PURE WAFER |
2116.0 kg |
381800
|
12 INCH SILICON WAFER HS#3818.00 |
2021-06-03 |
TCLIHTEX21050427 |
PURE WAFER |
288.0 kg |
854221
|
8 INCH SILICON WAFER |
2021-05-27 |
YATIYGLTYO069264 |
ADVANCED PERFORMANCE TECHNOLOGY |
379.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-27 |
YATIYGLTYO069459 |
PURE WAFER |
378.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-19 |
VHFLTYOTN2128103 |
|
1830.0 kg |
381800
|
8 INCH SILICON WAFER HS CODE:381800 |
2021-05-14 |
YATIYGLTYO069262 |
PURE WAFER |
1076.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-14 |
YATIYGLTYO069263 |
ADVANCED PERFORMANCE TECHNOLOGY |
386.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-14 |
YATIYGLTYO068600 |
ADVANCED PERFORMANCE TECHNOLOGY |
383.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-07 |
TSJLTCLW1004231 |
ADVANCED PERFORMANCE TECHNOLOGY |
380.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-05-01 |
YATIYGLTYO069554 |
PURE WAFER |
950.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-04-30 |
NAQAKOAK160451V |
WEST COAST SILICON |
182.0 kg |
854221
|
8 INCH SILICON WAFER |
2021-04-21 |
TCLIHTEX21030710 |
PURE WAFER |
1256.0 kg |
720250
|
12 INCH SILICON WAFER |
2021-04-21 |
EXDO6930181235 |
NORTH EAST SILICON TECHNOLOGIES IN |
441.0 kg |
381800
|
DOPED F/ELECTRONICS OF SILICON |
2021-04-12 |
DMALTYOA22664 |
PURE WAFER |
3041.0 kg |
720250
|
SILICON WAFER |
2021-04-04 |
YATIYGLTYO067340 |
PURE WAFER |
1084.0 kg |
720250
|
12 INCH SILICON WAFER |