DISCO CORP
Address: 13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO
DISCO CORP's Shipments Over Time
Supply Ratings
Shipment Reliability and Frequency Volume of Goods
Avg. Shipments per Month: 5.23 Average TEU per month: 7.67
Active Months: 13 Average TEU per Shipment: 1.35
Shipment Frequency Std. Dev.: 1.83
Shipments By Companies
Company Name Shipments
DISCO HI TEC AMERICA INC 66 shipments
INTEL CORP 30 shipments
INTEL TECHNOLOGY SDN BHD 22 shipments
WOLFSPEED INC 11 shipments
GE PRECISION HEALTHCARE LLC 4 shipments
SEMTECH COLORADO INC 3 shipments
GE PARALLEL DESIGN INC 2 shipments
10X GENOMICS INC 1 shipments
5DISCO HI TEC AMERICA INC 1 shipments
5N PLUS SEMICONDUCTORS 1 shipments
ATTN RS4 CAPITAL WAREHOUSE 1 shipments
AVAGO TECHNOLOGIES WIRELESS 1 shipments
CARNEGIE MELLON UNIVERSITY SCOTT HALL LOADING DOCK 1 shipments
CRITERIA LABS 1 shipments
DISCO HI TEC AMERICA OR 1 shipments
DORIC LENSES INC 1 shipments
GE HEALTHCARE 1 shipments
GE MEDICAL SYSTEMS 1 shipments
HARVARD UNIVERSITY 1 shipments
II VI ADVANCED MATERIALS INC 1 shipments
MICROSS COMPONENTS 1 shipments
MINI CIRCUITS 1 shipments
NEWPORT CORP 1 shipments
PHILIPS ULTRASOUND INC 1 shipments
QORVO US INC 1 shipments
ROBERT BOSCH LLC 1 shipments
SEMTECH COLORADO FEDERAL 1 shipments
SHENQI MEDICAL SIRIUS 1 shipments
SIEMENS MEDICAL SOLUTIONS USA INC 1 shipments
TRANDUCER WORKS 1 shipments
TRANSDUCER WORKS 1 shipments
UMASS LOWELL EMERGING TECHNOLOGIES & INNOVATION CENTER 1 shipments
UNIVERSITY OF BRITISH COLUMBIA 1 shipments
UNIVERSITY OF CALIFORNIA SAN DIEGO 1 shipments
UNIVERSITY OF MEMPHIS 1 shipments
UNIVERSITY OF WASHINGTON 1 shipments
WESTERN DIGITAL TECHNOLOGIES 1 shipments
Shipments By HS Code
HS Code Shipments
846410 Machine-tools; sawing machines, for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass 46 shipments
903141 Optical instruments and appliances; for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices, n.e.c. in chapter 90 39 shipments
847989 Machines and mechanical appliances; having individual functions, n.e.c. or included in this chapter 27 shipments
848620 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits 13 shipments
820299 Tools, hand; saw blades n.e.c. in heading no. 8202 7 shipments
848610 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers 6 shipments
851521 Welding machines and apparatus; for resistance welding of metal, fully or partly automatic, whether or not capable of cutting 5 shipments
854150 Electrical apparatus; photosensitive semiconductor devices n.e.c. in heading no. 8541, including photovoltaic cells, whether or not assembled in modules or made up into panels 5 shipments
854290 Parts of electronic integrated circuits 5 shipments
847690 Machines; parts of automatic goods-vending machines 4 shipments
390311 Styrene polymers; expansible polystyrene, in primary forms 3 shipments
490191 Printed matter; dictionaries, encyclopaedias and serial instalments thereof 2 shipments
847149 Automatic data processing machines; presented in the form of systems, n.e.c. in item no. 8471.30 or 8471.41 1 shipments
848020 Mould bases; for metal, metal carbides, glass, mineral materials, rubber or plastics 1 shipments
848640 Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486 1 shipments
851590 Welding, brazing or soldering machines; parts of the machines of heading no. 8515 1 shipments
852010 1 shipments
902230 X-ray tubes 1 shipments
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Latest Shipments
Arrival Date Bill Of Lading Consignee Weight HS Code Description
2024-08-30 NXGWTYOCNH74311 DISCO HI TEC AMERICA INC 1048.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-08-27 NXGWTYOCNF69395 UNIVERSITY OF BRITISH COLUMBIA 680.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-08-27 DSVFOSA8211004 WOLFSPEED INC 1958.0 kg 848610 (4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL NO. DKL7440SERIAL NO. FW5019,-50202 UNITHS CODE: 848610
2024-07-29 NXGWTYOCML13346 INTEL CORP 2401.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-20 NEDFTYOCMA35183 INTEL TECHNOLOGY SDN BHD 7345.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-13 NEDFTYOCMJ35951 DISCO HI TEC AMERICA INC 4037.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-08 DSVFOSA8205907 WOLFSPEED INC 1179.0 kg 848610 4 SKIDS(4 CARTONS)DISCO AUTOMATIC KABRA SPLITTERMODEL NO. DKS2240SERIAL NO. CB5029, 50302 UNITHS CODE: 848610
2024-07-07 NEDFTYOCLZ42230 DISCO HI TEC AMERICA INC 2593.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-28 NEDFTYOCLP08694 INTEL CORP 2401.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 NEDFTYOCLB63076 INTEL CORP 2441.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 NEDFTYOCKW64825 DISCO HI TEC AMERICA INC 1975.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 DSVFOSA8204584 WOLFSPEED INC 591.0 kg 848610 (2 SKIDS)DISCO AUTOMATIC KABRA SPLITTERMODEL NO. DKS2240SERIAL NO. CB50281 UNITHS CODE: 848610
2024-06-10 DSVFOSA8203673 WOLFSPEED INC 1179.0 kg 848610 STC 4 CARTON(S)(4 SKIDS)DISCO AUTOMATIC KABRASPLITTERMODEL NO. DKS2240SERIAL NO. CB5026, 50272 UNITHS CODE: 848610
2024-06-07 NEDFTYOCKT13141 INTEL CORP 2439.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-02 NEDFTYOCKM55616 INTEL CORP 290.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-30 NEDFTYOCKG76104 SHENQI MEDICAL SIRIUS 702.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-25 NEDFTYOCKJ48205 INTEL CORP 13178.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-25 NEDFTYOCKH78993 INTEL CORP 2442.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-22 NEDFTYOCKN07475 DISCO HI TEC AMERICA INC 5546.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-17 NEDFTYOCKF66414 INTEL CORP 2448.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-17 DSVFOSA8202560 WOLFSPEED INC 7821.0 kg 848610 (12 SKIDS)DISCO AUTOMATIC KABRA GRINDERMODEL NO.DKG810SERIAL NO. JU3160, 3189,3196.31974 UNITHS CODE: 848610
2024-05-01 DSVFOSA8200354 WOLFSPEED INC 12307.0 kg 848640 [2 STEEL CASES & 13 SKIDS(13 CARTONS)]FULLY AUTOMATIC IN-FEED SURFACEGRINDERMODEL NO. DFG8640SERIAL NO. RY11011 UNITDISCO AUTOMATIC KABRA GRINDERMODEL NO. DKG810SERIAL NO. JU3182,3183,3187,31884 UNITHS CODE 848640 [2 STEEL CASES & 13 SKIDS(13 CARTONS)]FULLY AUTOMATIC IN-FEED SURFACEGRINDERMODEL NO. DFG8640SERIAL NO. RY11011 UNITDISCO AUTOMATIC KABRA GRINDERMODEL NO. DKG810SERIAL NO. JU3182,3183,3187,31884 UNITHS CODE 848640
2024-04-22 NEDFTYOCJN47234 DISCO HI TEC AMERICA INC 1285.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-22 NEDFTYOCJM35923 INTEL CORP 2445.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-15 NEDFTYOCJK84030 INTEL CORP 2444.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-07 NEDFTYOCJD69271 INTEL CORP 2445.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-07 NEDFTYOCJD69573 INTEL CORP 2442.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-04-02 DSVFOSA8197470 WOLFSPEED INC 5090.0 kg 854150 SCRUBBER FOR SEMICONDUCTOR WAFERS
2024-03-25 NEDFTYOCHW51780 INTEL CORP 2444.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-03-25 NEDFTYOCHK47112 UNIVERSITY OF MEMPHIS 686.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-03-16 NEDFTYOCHL13270 DISCO HI TEC AMERICA INC 11645.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-03-11 DSVFOSA8196481 WOLFSPEED INC 5651.0 kg 854150 SCRUBBER FOR SEMICONDUCTOR WAFERS
2024-02-15 DSVFOSA8193344 WOLFSPEED INC 4485.0 kg 854150 SCRUBBER FOR SEMICONDUCTOR WAFERS
2024-02-06 NEDFTYOCGT68890 DISCO HI TEC AMERICA INC 2240.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-02-06 NEDFTYOCGB93122 INTEL TECHNOLOGY SDN BHD 2447.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-26 DSVFOSA8193343 WOLFSPEED INC 8955.0 kg 854150 SCRUBBER FOR SEMICONDUCTOR WAFERS
2024-01-24 NEDFTYOCFY00561 5DISCO HI TEC AMERICA INC 1310.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-17 YUGLYLJ23343782 II VI ADVANCED MATERIALS INC 5550.0 kg 848610 AUTOMATIC LASER SAW,AUTOMATIC SPLITTER,AUTOMATIC GRINDER, HS CODE:848610
2024-01-17 NEDFTYOCFK55473 INTEL TECHNOLOGY SDN BHD 2440.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-11 MEDUJA660524 MINI CIRCUITS 1321.0 kg 848620 AUTOMATIC DICING SAW MODEL NO.DAD3351 SERIAL NO.CV1090 1 SKID(1 UNIT) HS CODE: 848620
2024-01-09 NEDFTYOCFE50916 INTEL TECHNOLOGY SDN BHD 2450.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-03 NEDFTYOCFD03010 INTEL TECHNOLOGY SDN BHD 2441.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-03 NEDFTYOCFD13436 INTEL TECHNOLOGY SDN BHD 2444.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-01-03 NEDFTYOCEP54941 DISCO HI TEC AMERICA INC 597.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-12-27 DSVFOSA8191281 WOLFSPEED INC 1528.0 kg 854150 SCRUBBER FOR SEMICONDUCTOR WAFERS
2023-12-26 NEDFTYOCET31250 INTEL TECHNOLOGY SDN BHD 2443.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-12-09 NEDFTYOCEM65885 10X GENOMICS INC 684.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-12-06 NEDFTYOCEM69890 INTEL CORP 13083.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-12-01 NEDFTYOCEC35912 INTEL CORP 2481.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2023-11-28 FTNVOAS000001338 MICROSS COMPONENTS 2291.0 kg 848620 FULLY AUTOMATIC DICING SAWMODEL NO DFD6362SERIAL NO NLC6151 UNITHS CODE 8486202 SKIDS 2 CARTONS1 CARTON3 PACKAGES .
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13-11 OMORI-KITA X-CHOME TOKYO OTA-KU
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 JAPAN
2-13-11 OMORI KITA OTA WARD TOKYO
2-13-11 OMORI KITA
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 JAPAN
2-13-11 OMORIKITA
13-11 OMORI-KITA X-CHOME TOKYO OTA-KU
2-13-11 OMORI KITA OTA WARD TOKYO
13-11 OMORI-KITA 2-CHOME
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 JP
2-13-11 OMORIKITA
13-11 OMORI-KITA 2 CHOME
13-11 OMORI-KITA 2-CHOME OTA-KU T OKYO 143-8580 JAPAN
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO
1-23 HIROBUNKACHO KURE 737-0198 JP
13 11 OMORI KITA 2 CHOME OTA KU TOKYO JP
13-11 OMORI-KITA 2-CHOME OTA-KU
13-11 OMORI-KITA 2-CHOME OTA-KU TO KYO 143-8580 JAPAN
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 1438580 JP
2-13-11 OMORI-KITA
2-13-11 OMORI-KITA OTA-KU
2-13-11 OMORI-KITA OTA-KU 143-8580 JP
2-13-11 OMORIKITA TOKYO-TO 143-8580 JP
2-3-11 OMORI KITA OTA-KU TOKYO 143-0016 JP
2-3-11 OMORI KITA OTA-KU TOKYO 143-8580 JP
4010-1 GOHARA-CHO KURE-SHI HIROSHIMA 737-0161 JAPAN
13-11 OMORI-KITA 2-CHOME
13-11 OMORI-KITA 2-CHOME OHTA-KU 13 143-8580 JAPAN