DISCO CORP
Address: 13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO
DISCO CORP's Shipments Over Time
Supply Ratings
Shipment Reliability and Frequency Volume of Goods
Avg. Shipments per Month: 5.25 Average TEU per month: 9.12
Active Months: 12 Average TEU per Shipment: 1.74
Shipment Frequency Std. Dev.: 1.60
Shipments By Companies
Company Name Shipments
DISCO HI TEC AMERICA INC 76 shipments
INTEL CORP 44 shipments
INTEL TECHNOLOGY SDN BHD 22 shipments
WOLFSPEED INC 13 shipments
GE PRECISION HEALTHCARE LLC 4 shipments
SEMTECH COLORADO INC 3 shipments
GE PARALLEL DESIGN INC 2 shipments
10X GENOMICS INC 1 shipments
3D GLASS SOLUTIONS 1 shipments
5DISCO HI TEC AMERICA INC 1 shipments
5N PLUS SEMICONDUCTORS 1 shipments
AMS OSRAM USA INC 1 shipments
ATTN RS4 CAPITAL WAREHOUSE 1 shipments
AVAGO TECHNOLOGIES WIRELESS 1 shipments
CARNEGIE MELLON UNIVERSITY SCOTT HALL LOADING DOCK 1 shipments
CRITERIA LABS 1 shipments
DISCO HI TEC AMERICA OR 1 shipments
DORIC LENSES INC 1 shipments
DUPONT SPECIALTY PRODUCTS USA LLC 1 shipments
GE HEALTHCARE 1 shipments
GE MEDICAL SYSTEMS 1 shipments
HARVARD UNIVERSITY 1 shipments
II VI ADVANCED MATERIALS INC 1 shipments
LINTEC OF AMERICA INC 1 shipments
MICROSS COMPONENTS 1 shipments
MINI CIRCUITS 1 shipments
NEWPORT CORP 1 shipments
PHILIPS ULTRASOUND INC 1 shipments
QORVO US INC 1 shipments
ROBERT BOSCH LLC 1 shipments
SEMTECH COLORADO FEDERAL 1 shipments
SHENQI MEDICAL SIRIUS 1 shipments
SIEMENS MEDICAL SOLUTIONS USA INC 1 shipments
SOUND TECHNOLOGY INC 1 shipments
TRANDUCER WORKS 1 shipments
TRANSDUCER WORKS 1 shipments
UMASS LOWELL EMERGING TECHNOLOGIES & INNOVATION CENTER 1 shipments
UNIVERSITY OF BRITISH COLUMBIA 1 shipments
UNIVERSITY OF CALIFORNIA SAN DIEGO 1 shipments
UNIVERSITY OF MEMPHIS 1 shipments
UNIVERSITY OF WASHINGTON 1 shipments
WESTERN DIGITAL TECHNOLOGIES 1 shipments
Shipments By HS Code
HS Code Shipments
846410 Machine-tools; sawing machines, for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass 69 shipments
903141 Optical instruments and appliances; for inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices, n.e.c. in chapter 90 39 shipments
847989 Machines and mechanical appliances; having individual functions, n.e.c. or included in this chapter 27 shipments
848620 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits 15 shipments
820299 Tools, hand; saw blades n.e.c. in heading no. 8202 8 shipments
848610 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers 7 shipments
851521 Welding machines and apparatus; for resistance welding of metal, fully or partly automatic, whether or not capable of cutting 6 shipments
854150 Electrical apparatus; photosensitive semiconductor devices n.e.c. in heading no. 8541, including photovoltaic cells, whether or not assembled in modules or made up into panels 5 shipments
854290 Parts of electronic integrated circuits 5 shipments
847690 Machines; parts of automatic goods-vending machines 4 shipments
390311 Styrene polymers; expansible polystyrene, in primary forms 3 shipments
490191 Printed matter; dictionaries, encyclopaedias and serial instalments thereof 2 shipments
901320 Lasers; other than laser diodes 2 shipments
847149 Automatic data processing machines; presented in the form of systems, n.e.c. in item no. 8471.30 or 8471.41 1 shipments
848020 Mould bases; for metal, metal carbides, glass, mineral materials, rubber or plastics 1 shipments
848640 Machines and apparatus of a kind used solely or principally for the manufacture or repair of masks and reticles, assembling semiconductor devices or electronic integrated circuits, or for lifting, handling, loading or unloading items of heading 8486 1 shipments
851410 Furnaces and ovens; electric, for industrial or laboratory use, resistance heated 1 shipments
851590 Welding, brazing or soldering machines; parts of the machines of heading no. 8515 1 shipments
852010 1 shipments
902230 X-ray tubes 1 shipments
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Latest Shipments
Arrival Date Bill Of Lading Consignee Weight HS Code Description
2025-02-20 NXGWTYOCWD11253 INTEL CORP 12894.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-02-20 NXGWTYOCVD35236 INTEL CORP 13256.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-02-07 DSVFOSA8224184 AMS OSRAM USA INC 685.0 kg 901320 (4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL
2025-02-07 DSVFOSA8223873 WOLFSPEED INC 118.0 kg 901320 (4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL
2025-02-05 NXGWTYOCVG77982 DISCO HI TEC AMERICA INC 120.0 kg 851410 MACHINERY, PLANT OR LABORATORY EQUIPMENT, WHETHER OR NOT ELECTRICALLY HEATED (EXCLUDING FURNACES, OVENS AND OTHER EQUIPMENT OF HEADING
2025-01-10 TSJLYLJ24359014 SOUND TECHNOLOGY INC 1999.0 kg 848620 AUTOMATIC SURFACE GRINDER HS CODE 848620
2025-01-09 NXGWTYOCTX28053 DISCO HI TEC AMERICA INC 3305.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-05 NXGWTYOCTZ65040 INTEL CORP 14790.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-03 NXGWTYOCTL94152 DISCO HI TEC AMERICA INC 5603.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-02 NXGWTYOCTK61170 INTEL CORP 2404.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-02 NXGWTYOCTP70391 INTEL CORP 12991.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-02 NXGWTYOCTK59313 INTEL CORP 2404.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2025-01-02 NXGWTYOCTE70720 INTEL CORP 7342.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-12-19 YATIYGLTYO105903 LINTEC OF AMERICA INC 13001.0 kg 851521 FULLY AUTOMATIC GRINDER FULLY AUTOMATIC GRINDER
2024-12-12 NXGWTYOCTC95020 DISCO HI TEC AMERICA INC 165.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-12-10 NXGWTYOCSY05645 INTEL CORP 6924.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-12-10 NXGWTYOCSX05232 DISCO HI TEC AMERICA INC 684.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-12-06 NXGWTYOCSR48341 INTEL CORP 2366.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-11-30 DMALOSAA30189 DUPONT SPECIALTY PRODUCTS USA LLC 1278.0 kg 820299 AUTOMATIC DICING SAW
2024-11-25 NXGWTYOCSH92881 INTEL CORP 13453.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-11-25 NXGWTYOCSH95633 INTEL CORP 7339.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-11-19 NXGWTYOCSR42380 INTEL CORP 12447.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-11-07 NXGWTYOCRR94201 DISCO HI TEC AMERICA INC 1319.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-11-07 NXGWTYOCRR94282 DISCO HI TEC AMERICA INC 1555.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-10-29 NXGWTYOCRN05391 INTEL CORP 12448.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-10-04 NXGWTYOCPZ67891 DISCO HI TEC AMERICA INC 3979.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-10-04 NXGWTYOCPE73136 DISCO HI TEC AMERICA INC 678.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-10-03 NXGWTYOCPH28905 DISCO HI TEC AMERICA INC 1860.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-09-21 SEINSOLAX24H0009 3D GLASS SOLUTIONS 1110.0 kg 848620 AUTOMATIC SURFACE PLANER HS CODE 848620
2024-09-13 NXGWTYOCNK14035 INTEL CORP 8808.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-09-03 DSVFOSA8208051 WOLFSPEED INC 1564.0 kg 848610 (4 SKIDS)DISCO AUTOMATIC KABRA SPLITTERMODEL NO. DKS2240SERIAL NO. CB50321 UNITDISCOAUTOMATIC KABRA LASER SAWMODEL NO. DKL7440SERIAL NO. FW50171 UNITHS CODE:848610
2024-08-30 NXGWTYOCNH74311 DISCO HI TEC AMERICA INC 1048.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-08-27 DSVFOSA8211004 WOLFSPEED INC 1958.0 kg 848610 (4 SKIDS)DISCOAUTOMATIC KABRA LASER SAWMODEL NO. DKL7440SERIAL NO. FW5019,-50202 UNITHS CODE: 848610
2024-08-27 NXGWTYOCNF69395 UNIVERSITY OF BRITISH COLUMBIA 680.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-29 NXGWTYOCML13346 INTEL CORP 2401.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-20 NEDFTYOCMA35183 INTEL TECHNOLOGY SDN BHD 7345.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-13 NEDFTYOCMJ35951 DISCO HI TEC AMERICA INC 4037.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-07-08 DSVFOSA8205907 WOLFSPEED INC 1179.0 kg 848610 4 SKIDS(4 CARTONS)DISCO AUTOMATIC KABRA SPLITTERMODEL NO. DKS2240SERIAL NO. CB5029, 50302 UNITHS CODE: 848610
2024-07-07 NEDFTYOCLZ42230 DISCO HI TEC AMERICA INC 2593.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-28 NEDFTYOCLP08694 INTEL CORP 2401.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 NEDFTYOCLB63076 INTEL CORP 2441.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 NEDFTYOCKW64825 DISCO HI TEC AMERICA INC 1975.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-14 DSVFOSA8204584 WOLFSPEED INC 591.0 kg 848610 (2 SKIDS)DISCO AUTOMATIC KABRA SPLITTERMODEL NO. DKS2240SERIAL NO. CB50281 UNITHS CODE: 848610
2024-06-10 DSVFOSA8203673 WOLFSPEED INC 1179.0 kg 848610 STC 4 CARTON(S)(4 SKIDS)DISCO AUTOMATIC KABRASPLITTERMODEL NO. DKS2240SERIAL NO. CB5026, 50272 UNITHS CODE: 848610
2024-06-07 NEDFTYOCKT13141 INTEL CORP 2439.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-06-02 NEDFTYOCKM55616 INTEL CORP 290.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-30 NEDFTYOCKG76104 SHENQI MEDICAL SIRIUS 702.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-25 NEDFTYOCKJ48205 INTEL CORP 13178.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-25 NEDFTYOCKH78993 INTEL CORP 2442.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
2024-05-22 NEDFTYOCKN07475 DISCO HI TEC AMERICA INC 5546.0 kg 846410 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE
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13-11 OMORI-KITA X-CHOME TOKYO OTA-KU
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 JAPAN
2-13-11 OMORI KITA OTA WARD TOKYO
13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO 143-8580 JAPAN
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2-13-11 OMORI KITA OTA WARD TOKYO
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13-11 OMORI KITA 2-CHOME
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13-11 OMORI-KITA 2-CHOME OTA-KU TOKYO
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2-13-11 OMORI-KITA OTA-KU 143-8580 JP
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2-3-11 OMORI KITA OTA-KU TOKYO 143-0016 JP
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4010-1 GOHARA-CHO KURE-SHI HIROSHIMA 737-0161 JAPAN
13-11 OMORI-KITA 2-CHOME
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