MICRON TECHNOLOGY TAIWAN INC
Address: NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST
MICRON TECHNOLOGY TAIWAN INC's Shipments Over Time
Supply Ratings
Shipment Reliability and Frequency Volume of Goods
Avg. Shipments per Month: 0.11 Average TEU per month: 0.29
Active Months: 2 Average TEU per Shipment: 1.75
Shipment Frequency Std. Dev.: 0.32
Shipments By Companies
Company Name Shipments
MICRON TECHNOLOGY INC 19 shipments
SPT MICROTECHNOLOGIES USA INC 3 shipments
TEXAS INSTRUMENTS INCORPORATED 3 shipments
CAPITAL ASSET EXCHANGE AND TRADE 1 shipments
JTM TECHNOLOGIES INC 1 shipments
Shipments By HS Code
HS Code Shipments
848620 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor devices or of electronic integrated circuits 9 shipments
470500 Wood pulp; obtained by a combination of mechanical and chemical pulping processes 3 shipments
854389 Electrical machines and apparatus; having individual functions, not specified or included elsewhere in this chapter 3 shipments
903180 Instruments, appliances and machines; for measuring or checking n.e.c. in chapter 90 3 shipments
841610 Furnaces; furnace burners, for liquid fuel 2 shipments
091091 Spices; mixtures of 2 or more products of different headings 1 shipments
847149 Automatic data processing machines; presented in the form of systems, n.e.c. in item no. 8471.30 or 8471.41 1 shipments
847989 Machines and mechanical appliances; having individual functions, n.e.c. or included in this chapter 1 shipments
853224 Electrical capacitors; fixed, ceramic dielectric, multilayer 1 shipments
903082 Instruments and apparatus; for measuring or checking semiconductor wafers or devices 1 shipments
940350 Furniture; wooden, for bedroom use 1 shipments
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Latest Shipments
Arrival Date Bill Of Lading Consignee Weight HS Code Description
2024-05-10 CNSVKKLM2404013 MICRON TECHNOLOGY INC 9882.0 kg 847149 001 WET PLATING AND CLEAN SYSTEM, MAKER APPL 486.20 001 WET PLATING AND CLEAN SYSTEM, MAKER APPL 486.20
2023-10-08 GPBBKEOAK2309001 CAPITAL ASSET EXCHANGE AND TRADE 5420.0 kg 848620 12 SEMICONDUCTOR EDUIPMENT LAM ETCHER SYSTEM MODEL: 2300 KIYO HS CODE: 8486.20
2023-04-28 CNSVBKEOA3040001 MICRON TECHNOLOGY INC 12114.0 kg 848620 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 . 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 . 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTE 5348 INV1728499 HS CODE8486.20 .
2022-10-31 CNSVKKLM2209040 MICRON TECHNOLOGY INC 4733.0 kg 903180 SEM - CRITICAL DIMENSION (CD) MEASUREMENT MOD3500854827 HS CODE9031.80 .
2022-09-22 CNSVKSEA2207016 MICRON TECHNOLOGY INC 25342.0 kg 848620 MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 . MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 . MEDIUM CURRENT ION IMPLANTER MODELVIISTA 810 HS CODE8486.20 .
2022-09-22 CNSVKSEA2207018 MICRON TECHNOLOGY INC 9049.0 kg 848620 12SEMICONDUCTOR EQUIPMENT AMAT PLASMA ETCHIN 3382 P.O.4510848437 HS CODE8486.20 . 12SEMICONDUCTOR EQUIPMENT AMAT PLASMA ETCHIN 3382 P.O.4510848437 HS CODE8486.20 .
2022-08-27 KWEO594040688273 TEXAS INSTRUMENTS INCORPORATED 13172.0 kg 470500 CHEMICAL MECHANICAL PLANARIZATION (CMP) CHEMICAL MECHANICAL PLANARIZATION (CMP)
2022-08-11 CNSVKSEA2206001 MICRON TECHNOLOGY INC 9278.0 kg 854389 TIN CHEMICAL VAPOR DEPOSITION INV NO.1614388 6.20 . TIN CHEMICAL VAPOR DEPOSITION INV NO.1614388 6.20 .
2022-08-10 OSTITPOAK2260648 SPT MICROTECHNOLOGIES USA INC 6316.0 kg 848620 VERTICAL DIFFUSION FURNACE MODEL RVP 300 HS CODE 8486 20 ACCORDING TO SHIPPER THIS WOOD USED IN THE PACKING HAS BEEN MANUFACTURED IN ACCORDANCE WITH IPPC STANDARDS SCAC CODE OSTI AMS B L OSTITPOAK2260648
2022-08-03 OSTITPOAK2260563 SPT MICROTECHNOLOGIES USA INC 6286.0 kg 848620 VERTICAL DIFFUSION FURNACE MODEL RVP 300 HS CODE 8486 20 ACCORDING TO SHIPPER THIS WOOD USED IN THE PACKING HAS BEEN MANUFACTURED IN ACCORDANCE WITH IPPC STANDARDS SCAC CODE OSTI AMS B L OSTITPOAK2260563
2022-07-28 NMCLKSEA2205010 MICRON TECHNOLOGY INC 9576.0 kg 854389 TIN CHEMICAL VAPOR DEPOSITION TIN CHEMICAL VAPOR DEPOSITION (APPARATUS FOR .
2022-07-22 CNSVKSEA2205030 MICRON TECHNOLOGY INC 4508.0 kg 841610 VERTICAL DIFFUSION FURNACE INV1615727 MICAP . . VERTICAL DIFFUSION FURNACE INV1615727 MICAP . .
2022-07-11 CNSVKSEA2206028 MICRON TECHNOLOGY INC 7900.0 kg 841610 VERTICAL DIFFUSION FURNACE MODELQUIXACE II P . . VERTICAL DIFFUSION FURNACE MODELQUIXACE II P . .
2022-07-09 KWEO594040681170 TEXAS INSTRUMENTS INCORPORATED 12876.0 kg 470500 CHEMICAL MECHANICAL PLANARIZATION (CMP) CHEMICAL MECHANICAL PLANARIZATION (CMP)
2022-06-27 KWEO594040679696 TEXAS INSTRUMENTS INCORPORATED 12700.0 kg 853224 DIELECTRIC ETCH TELIUS SP- 305 SCCM DIELECTRIC ETCH TELIUS SP- 305 SCCM
2022-06-25 TGBJTPGS2206032 JTM TECHNOLOGIES INC 10376.0 kg 848620 12 SEMICONDUCTOR EQUIPMENT LAM ETCHER INV NO.1640885 TRADE TERM.COLLECT HS : 848620 12 SEMICONDUCTOR EQUIPMENT LAM ETCHER INV NO.1640885 TRADE TERM.COLLECT HS : 848620 12 SEMICONDUCTOR EQUIPMENT LAM ETCHER INV NO.1640885 TRADE TERM.COLLECT HS : 848620
2022-05-19 OSTITPOAK2240062 SPT MICROTECHNOLOGIES USA INC 6277.0 kg 848620 VERTICAL DIFFUSION FURNACE MODEL RVP 300 HS CODE 8486 20 ACCORDING TO SHIPPER THIS WOOD USED IN THE PACKING HAS BEEN MANUFACTURED IN ACCORDANCE WITH IPPC STANDARDS SCAC CODE OSTI AMS B L OSTITPOAK2240062
2021-11-30 MIGCKSEA2108057 MICRON TECHNOLOGY INC 11000.0 kg 847989 HIGH DENSITY PLASMA CVD INV1527429 MICAP130 . . HIGH DENSITY PLASMA CVD INV1527429 MICAP130 . .
2021-11-01 CNSVKSEA219016 MICRON TECHNOLOGY INC 9134.0 kg 903180 12 SEMICONDUCTOR EQUIPMENT LAM ETCHER SYSTEM . 12 SEMICONDUCTOR EQUIPMENT LAM ETCHER SYSTEM .
2021-10-22 CNSVKSEA2109022 MICRON TECHNOLOGY INC 1245.0 kg 903082 MEASURE MASSMODEL METRYX-DF3 HS CODE9030.82
2021-10-09 CNSVKSEA2108029 MICRON TECHNOLOGY INC 8987.0 kg 848620 LAM ETCHER SYSTEM HS CODE8486.20 LAM ETCHER SYSTEM HS CODE8486.20
2021-09-28 MIGCKSEA2108026 MICRON TECHNOLOGY INC 10400.0 kg 470500 12 OXIDE CHEMICAL MECHANICAL POLISHER CHILLER. .
2021-09-28 MIGCKSEA2108028 MICRON TECHNOLOGY INC 7058.0 kg 854389 FCVD (FLOW ABLE CHEMICAL VAPOR DEPOSITION) .
2021-09-24 TXSL6200136802 MICRON TECHNOLOGY INC 9770.0 kg 091091 MICRON TECHNOLOGY, INC. US CRATE1/NO:1/9-9/9 1532040 FROM TAIWAN
2021-06-10 NMCLKSEA2104011 MICRON TECHNOLOGY INC 1950.0 kg 940350 TMEIC OZONE GENERATOR(USED), SRC350 VEHICLE
2021-05-17 EGLDKSEA2103067 MICRON TECHNOLOGY INC 9700.0 kg 903180 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTEM. 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTEM. 12 SEMICONDUCTOR EQUIPMENT AMAT ETCHER SYSTEM.
2021-04-25 NMCLKSEA2102051 MICRON TECHNOLOGY INC 2800.0 kg N2 PURIFIER
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Other address
NO 667 FUHSING 3RD RD HWA YA TECHNOLOGY PARK GUISHAN DIST TAOYUAN CITY 3 3383 TAIWAN
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK
NO 667 FUHSING 3RD RD HWA YA TE CHNOLOGY PARK GUISHAN DIST TAOYU AN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA YA TE CHNOLOGY PARK GUISHAN DIST TAOY UAN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA YA TECHNOLOGY PARK GUISHAN DIST
NO 667 FUHSING 3RD RD HWA-YA TE CHNOLOGY PARK GUISHAN DIST TAOYU AN CITY 33383 TAIWAN
NO 667 FUHSING 3RD RD HWA-YA TE CHNOLOGYPARK GUISHAN DIST TAOYUA N CITY 33383 TAOYUAN TW
NO 667 FUHSING 3RD RD HWA-YA TECHNOLOGY PARK GUISHAN DIST TAOYUAN CITY 33383 TAIWAN