2024-10-26 |
EMLTHKGS00138676 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
489.0 kg |
251319
|
HEAT SINK |
2024-10-25 |
KWEO520047144211 |
WISTRON INFOCOMM TECHNOLOGY AMERICA CORP |
383.0 kg |
850134
|
DC FAN |
2024-10-23 |
AMIGL240446186A |
QCH INC |
1442.0 kg |
730900
|
THERMAL MODULE |
2024-10-20 |
EMLTHKGS00136404 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
1516.0 kg |
251319
|
HEAT SINK |
2024-10-20 |
KWEO520047142402 |
WISTRON INFOCOMM TECHNOLOGY AMERICA CORP |
119.0 kg |
251319
|
HEAT SINK |
2024-10-12 |
DFDSHKG1257523 |
HARMAN MFG PRO TJ C/O JD GROUP |
163.0 kg |
480220
|
HEAT SINK USE FOR ELECTRONICAL |
2024-10-11 |
EMLTHKGS00133754 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
288.0 kg |
251319
|
HEAT SINK |
2024-10-11 |
KWEO520047139845 |
WISTRON INFOCOMM TECHNOLOGY AMERICA CORP |
120.0 kg |
251319
|
HEAT SINK |
2024-10-11 |
EMLTHKGS00132638 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
1171.0 kg |
251319
|
HEAT SINK |
2024-09-29 |
KWEO520047124880 |
WISTRON INFOCOMM TECHNOLOGY AMERICA CORP |
233.0 kg |
251319
|
HEAT SINK |
2024-09-29 |
EMLTHKGS00128197 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
2552.0 kg |
840290
|
COMPUTER PARTS (HEAT SINK) |
2024-09-29 |
EMLTHKGS00127068 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
671.0 kg |
840290
|
COMPUTER PARTS (HEAT SINK) |
2024-09-29 |
PVIDSH40900095 |
QCH INC |
3844.0 kg |
847330
|
THERMAL MODULE HTS: 8473309100 |
2024-09-23 |
EMLTHKGS00125436 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
593.0 kg |
251319
|
HEAT SINK |
2024-09-14 |
KWEO520047119652 |
WISTRON INFOCOMM TECHNOLOGY AMERICA |
122.0 kg |
251319
|
HEAT SINK |
2024-09-13 |
EMLTHKGS00121649 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
358.0 kg |
251319
|
HEAT SINK |
2024-09-13 |
YASVSHA0908449 |
QCH INC |
4868.0 kg |
730900
|
THERMAL MODULE |
2024-09-12 |
MOXRPVGS2405096 |
IEC TECHNOLOGIES S DE R L DE C V |
486.0 kg |
730900
|
THERMAL MODULE 2PACKAGES=56CARTONS |
2024-08-30 |
EMLTHKGS00115902 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
284.0 kg |
251319
|
HEAT SINK |
2024-08-28 |
EXDO6395894369 |
ZT GROUP |
1744.0 kg |
730900
|
THERMAL MODULE HTS: |
2024-08-23 |
EMLTHKGS00114207 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
978.0 kg |
251319
|
HEAT SINK |
2024-08-23 |
EMLTHKGS00113051 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
2806.0 kg |
251319
|
HEAT SINK |
2024-07-28 |
EMLTHKGS00101901 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
740.0 kg |
251319
|
HEAT SINK |
2024-07-28 |
EMLTHKGS00103042 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
468.0 kg |
251319
|
HEAT SINK |
2024-07-28 |
EXDO6911594440 |
NSG TECHNOLOGY INC |
161.0 kg |
251319
|
HEAT SINK HTS: |
2024-07-23 |
BWLESHA47705115 |
FLEXTRONICS INTERNATIONAL USA INC |
1743.0 kg |
730900
|
THERMAL MODULE |
2024-07-21 |
EXDO6395876306 |
ZT GROUP |
1744.0 kg |
848140
|
RELIEF VALVES HTS: |
2024-07-18 |
KWEO520047091674 |
WIWYNN INTERNATIONAL CORP |
187.0 kg |
251319
|
HEAT SINK |
2024-07-18 |
BWLESHA47705111 |
FLEXTRONICS INTERNATIONAL USA INC |
1743.0 kg |
730900
|
THERMAL MODULE |
2024-07-12 |
EMLTHKGS00096416 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
169.0 kg |
251319
|
HEAT SINK |
2024-07-12 |
EMLTHKGS00092961 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
525.0 kg |
251319
|
HEAT SINK |
2024-07-03 |
KWEO520047084383 |
WISTRON INFOCOMM TECHNOLOGY AMERICA CORP |
123.0 kg |
251319
|
HEAT SINK |
2024-06-28 |
KWEO880140432724 |
WISTRON MEXICO S A DE C V |
172.0 kg |
251319
|
HEAT SINK--19CTNS=1PLT(11CTN)+5PKG(8CTNS)--GA. |
2024-06-28 |
EMLTHKGS00091173 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
619.0 kg |
840290
|
COMPUTER PARTS (HEAT SINK) |
2024-06-28 |
EMLTHKGS00090045 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
887.0 kg |
840290
|
COMPUTER PARTS (HEAT SINK) |
2024-06-28 |
DFDSHKG1218927 |
HARMAN MFG PRO TJ C/O JD GROUP |
234.0 kg |
480220
|
HEAT SINK USE FOR ELECTRONICAL |
2024-06-28 |
KWEO880140433528 |
WISTRON MEXICO S A DE C V |
215.0 kg |
848180
|
HEAT SINK--2PLTS S.T.C. 30CTNS-GATE IN |
2024-06-27 |
AMIGL240255115A |
QCH INC |
1378.0 kg |
730900
|
THERMAL MODULE |
2024-06-21 |
EMLTHKGS00088460 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
482.0 kg |
251319
|
HEAT SINK |
2024-06-20 |
YASVSHA0889878 |
QCH INC |
2268.0 kg |
730900
|
THERMAL MODULE |
2024-06-16 |
EMLTHKGS00084742 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
1443.0 kg |
251319
|
HEAT SINK |
2024-06-16 |
EMLTHKGS00085434 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
1626.0 kg |
251319
|
HEAT SINK |
2024-06-09 |
EMLTHKGS00082243 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
126.0 kg |
251319
|
HEAT SINK |
2024-06-06 |
EXDO6395872962 |
ZT GROUP |
1046.0 kg |
730900
|
THERMAL MODULE HTS: |
2024-05-31 |
EMLTHKGS00075121 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
279.0 kg |
251319
|
HEAT SINK |
2024-05-31 |
EMLTHKGS00078369 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
437.0 kg |
251319
|
HEAT SINK |
2024-05-31 |
EMLTHKGS00079464 |
CLOUD NETWORK TECHNOLOGY SINGAPORE PTE |
353.0 kg |
251319
|
HEAT SINK |
2024-05-13 |
GBWQ6040646556 |
OLA LOGISTICS LLC |
163.0 kg |
730900
|
THERMAL MODULE |
2024-05-13 |
EXDO6395869537 |
ZT GROUP |
4301.0 kg |
730900
|
THERMAL MODULE HTS: |
2024-05-10 |
EMLTHKGS00072018 |
CLOUD NETWORK TECHNOLOGY SINGAPORE LTD |
74.0 kg |
251319
|
HEAT SINK |