Shipment Reliability and Frequency | Volume of Goods |
---|---|
Avg. Shipments per Month: 0.17 | Average TEU per month: 0.21 |
Active Months: 1 | Average TEU per Shipment: 1.25 |
Shipment Frequency Std. Dev.: 0.58 |
Company Name | Shipments |
---|---|
SILICON VALLEY MICROELECTRONICS | 2 shipments |
SILICON VALLEY MICROELECTRONICS INC | 2 shipments |
HS Code | Shipments |
---|---|
842119 Centrifuges; n.e.c. in heading no. 8421, including centrifugal dryers (but not clothes-dryers) | 8 shipments |
291249 Aldehyde-alcohols, aldehyde-ethers, aldehyde-phenols and aldehydes with other oxygen function; other than vanillin (4-hydroxy-3-methoxybenzaldehyde) and ethylvanillin (3-ethoxy-4-hydroxybenzaldehyde) | 1 shipments |
381800 Chemical elements; doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics | 1 shipments |
851539 Welding machines and apparatus; for arc (including plasma arc) welding of metals, other than fully or partly automatic, whether or not capable of cutting | 1 shipments |
Arrival Date | Bill Of Lading | Consignee | Weight | HS Code | Description |
---|---|---|---|---|---|
2024-06-08 | DMERDFS012114910 | SILICON VALLEY MICROELECTRONICS INC | 1170.0 kg | 842119 | 12 RECLAIM WAFER - MECHANICAL WAFER . |
2024-06-01 | DMERDFS012114739 | SILICON VALLEY MICROELECTRONICS INC | 1170.0 kg | 842119 | 12 RECLAIM WAFER - MECHANICAL WAFER - CU . |
2023-08-19 | DFDSTP90042804 | SILICON VALLEY MICROELECTRONICS | 390.0 kg | 851539 | 12 RECLAIM WAFER - NON-CU P TYPE(PARTICLE WA FER)-A |
2023-06-27 | DFDSTP90038961 | SILICON VALLEY MICROELECTRONICS | 1925.0 kg | 291249 | 12 RECLAIM WAFER - NON-CU P |
2022-12-07 | DMERDFS012107904 | 1535.0 kg | 842119 | 12 RECLAIM WAFER - NON-CU . . | |
2022-10-21 | DMERDFS012107139 | 764.0 kg | 842119 | 12 RECLAIM WAFER - NON-CU . . | |
2022-10-02 | DMERDFS012106824 | 1146.0 kg | 842119 | 12 RECLAIM WAFER - NON-CU (PARTICLE WAFER) . . | |
2022-09-01 | SCNL3US2208010 | 1528.0 kg | 842119 | 12 RECLAIM WAFER NON_CU PARTICLE WAFER INV NO 230 2022070075 76 EX WORK TERM . . | |
2022-01-05 | SCNL3US2112024 | 1455.0 kg | 381800 | 27 PKGS 3WDC 2PLT 24CTNS 5 PKGS 12 RECLAIM WAFER NON_CU PARTICLE WAFER INV NO 230 2021110157 158 HS CODE 3818 00 EX WORK TERM | |
2021-12-04 | DMERDFS012102056 | 527.0 kg | 842119 | 12 RECLAIM WAFER - NON CU (PARTICLE WAFER) | |
2021-03-04 | DMERDFS012098338 | 1142.0 kg | 842119 | 12 RECLAIM WAFER - NON CU (PARTICLE WAFER) INAMS DFS012098338 . |