2024-12-29 |
KWEO111045823204 |
S E H AMERICA INC |
4860.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-16 |
KWEO111045823182 |
S E H AMERICA INC |
5333.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-10 |
KWEO111046685011 |
S E H AMERICA INC |
88.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
2024-12-08 |
KWEO111045823171 |
S E H AMERICA INC |
5038.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-06 |
KWEO111048268584 |
SEH AMERICA INC |
8256.0 kg |
392310
|
CRATES & SIMILAR (3923.10) CRATES & SIMILAR (3923.10) |
2024-12-06 |
NXGWTYOCTC74554 |
S E H AMERICA INC |
1885.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-11-29 |
KWEO111045823160 |
S E H AMERICA INC |
5536.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-11-27 |
KWEO111046684952 |
S E H AMERICA INC |
574.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
2024-11-27 |
NXGWTYOCSV33242 |
S E H AMERICA INC |
4628.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-11-25 |
KWEO111045823156 |
S E H AMERICA INC |
4940.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-11-17 |
NXGWTYOCSG36125 |
S E H AMERICA INC |
4930.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-10-29 |
NXGWTYOCRW73672 |
S E H AMERICA INC |
11600.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-10-29 |
KWEO111045822751 |
S E H AMERICA INC |
4779.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-10-29 |
KWEO111046684764 |
S E H AMERICA INC |
721.0 kg |
790500
|
PETS SHEET (7020.00) |
2024-10-29 |
KWEO111047744306 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
2024-10-25 |
KWEO111045822762 |
S E H AMERICA INC |
5225.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN (3818.00) |
2024-10-17 |
KWEO111048663476 |
S E H AMERICA INC |
2188.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN (3818.00) |
2024-09-20 |
KWEO111045822191 |
S E H AMERICA INC |
13337.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-09-17 |
KWEO111046684543 |
S E H AMERICA INC |
185.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
2024-09-12 |
NXGWTYOCPZ11073 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-12 |
NXGWTYOCPS82631 |
S E H AMERICA INC |
5791.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-08 |
NXGWTYOCPL90003 |
S E H AMERICA INC |
8667.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-06 |
NXGWTYOCNN39624 |
S E H AMERICA INC |
5740.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-06 |
KWEO111045821955 |
S E H AMERICA INC |
3719.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-08-29 |
KWEO111045821933 |
S E H AMERICA INC |
5001.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-08-29 |
KWEO111046684532 |
S E H AMERICA INC |
910.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
2024-08-27 |
KWEO111046684565 |
S E H AMERICA INC |
3089.0 kg |
450310
|
PARTS FOR KP300 PULLER (6815.19) |
2024-07-26 |
KWEO111045821443 |
S E H AMERICA INC |
4683.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-25 |
KWEO111045821631 |
S E H AMERICA INC |
5758.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-25 |
NXGWTYOCMK69916 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-07-20 |
KWEO111045821255 |
S E H AMERICA INC |
5202.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-20 |
NEDFTYOCLX31784 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-07-20 |
KWEO111046684226 |
S E H AMERICA INC |
475.0 kg |
710410
|
QUARTZ CONE (7020.00) |
2024-07-18 |
KWEO111045821432 |
S E H AMERICA INC |
5753.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-12 |
NEDFTYOCLX30340 |
S E H AMERICA INC |
8682.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-07-12 |
KWEO111045821244 |
S E H AMERICA INC |
4879.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-08 |
KWEO111047725620 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
2024-07-08 |
KWEO111046684215 |
S E H AMERICA INC |
785.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
2024-07-08 |
KWEO111045821233 |
S E H AMERICA INC |
8166.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-06-24 |
NEDFTYOCLN35201 |
S E H AMERICA INC |
11576.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-06-24 |
KWEO111045821222 |
S E H AMERICA INC |
8228.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-06-21 |
KWEO111045821045 |
S E H AMERICA INC |
8071.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN (3818.00) SILICON WAFER DOPED FOR USE IN (3818.00) |
2024-06-14 |
KWEO111046688323 |
S E H AMERICA INC |
29.0 kg |
710410
|
QUARTZ CONE (7020.00) |
2024-06-05 |
KWEO111045821034 |
S E H AMERICA INC |
7766.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-06-05 |
NEDFTYOCLB37073 |
S E H AMERICA INC |
8628.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-06-02 |
KWEO111046687925 |
S E H AMERICA INC |
460.0 kg |
820411
|
CARDBOARD BOX (4819.10) |
2024-06-02 |
KWEO111045820780 |
S E H AMERICA INC |
14033.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-05-25 |
KWEO111045820695 |
S E H AMERICA INC |
8508.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-05-19 |
KWEO111045820776 |
S E H AMERICA INC |
12436.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-05-18 |
KWEO111046687892 |
S E H AMERICA INC |
626.0 kg |
820411
|
CARDBOARD BOX (3926.90) |