2025-02-26 |
NXGWTYOCWL16213 |
S E H AMERICA INC |
2900.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2025-02-22 |
KWEO111045824103 |
S E H AMERICA INC |
7090.0 kg |
920510
|
PARTS FOR PULLER (8414.10) |
2025-02-22 |
KWEO111045824722 |
S E H AMERICA INC |
2520.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2025-02-21 |
KWEO111045824114 |
S E H AMERICA INC |
8450.0 kg |
903300
|
PARTS FOR PULLER (8486.90) |
2025-02-20 |
KWEO111047744962 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
2025-02-20 |
KWEO111045824044 |
S E H AMERICA INC |
5269.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2025-02-06 |
KWEO111048693462 |
S E H AMERICA INC |
86.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
2025-02-02 |
NXGWTYOCVH30331 |
S E H AMERICA INC |
14748.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2025-02-01 |
KWEO111045824033 |
S E H AMERICA INC |
3526.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2025-01-24 |
KWEO111045824022 |
S E H AMERICA INC |
2992.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2025-01-20 |
KWEO111048693451 |
S E H AMERICA INC |
698.0 kg |
710410
|
QUARTZ CONE (7020.00) |
2025-01-20 |
KWEO111047744774 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
2025-01-10 |
KWEO111045823742 |
S E H AMERICA INC |
11252.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2025-01-02 |
NXGWTYOCTX29173 |
S E H AMERICA INC |
17400.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2025-01-02 |
KWEO111048693440 |
S E H AMERICA INC |
2212.0 kg |
820411
|
CARDBOARD BOX (3926.90) CARDBOARD BOX (3926.90) |
2024-12-30 |
KWEO111045823193 |
S E H AMERICA INC |
5408.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-29 |
KWEO111045823204 |
S E H AMERICA INC |
4860.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-16 |
KWEO111045823182 |
S E H AMERICA INC |
5333.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-10 |
KWEO111046685011 |
S E H AMERICA INC |
88.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
2024-12-08 |
KWEO111045823171 |
S E H AMERICA INC |
5038.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-12-06 |
NXGWTYOCTC74554 |
S E H AMERICA INC |
1885.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-12-06 |
KWEO111048268584 |
SEH AMERICA INC |
8256.0 kg |
392310
|
CRATES & SIMILAR (3923.10) CRATES & SIMILAR (3923.10) |
2024-11-29 |
KWEO111045823160 |
S E H AMERICA INC |
5536.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-11-27 |
KWEO111046684952 |
S E H AMERICA INC |
574.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
2024-11-27 |
NXGWTYOCSV33242 |
S E H AMERICA INC |
4628.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-11-25 |
KWEO111045823156 |
S E H AMERICA INC |
4940.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-11-17 |
NXGWTYOCSG36125 |
S E H AMERICA INC |
4930.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-10-29 |
KWEO111047744306 |
SEH AMERICA INC |
8256.0 kg |
391590
|
PLASTICS (3923.10) PLASTICS (3923.10) |
2024-10-29 |
KWEO111045822751 |
S E H AMERICA INC |
4779.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-10-29 |
KWEO111046684764 |
S E H AMERICA INC |
721.0 kg |
790500
|
PETS SHEET (7020.00) |
2024-10-29 |
NXGWTYOCRW73672 |
S E H AMERICA INC |
11600.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-10-25 |
KWEO111045822762 |
S E H AMERICA INC |
5225.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN (3818.00) |
2024-10-17 |
KWEO111048663476 |
S E H AMERICA INC |
2188.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN (3818.00) |
2024-09-20 |
KWEO111045822191 |
S E H AMERICA INC |
13337.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-09-17 |
KWEO111046684543 |
S E H AMERICA INC |
185.0 kg |
820411
|
CARDBOARD BOX (2804.61) |
2024-09-12 |
NXGWTYOCPZ11073 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-12 |
NXGWTYOCPS82631 |
S E H AMERICA INC |
5791.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-08 |
NXGWTYOCPL90003 |
S E H AMERICA INC |
8667.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-06 |
NXGWTYOCNN39624 |
S E H AMERICA INC |
5740.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-09-06 |
KWEO111045821955 |
S E H AMERICA INC |
3719.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-08-29 |
KWEO111045821933 |
S E H AMERICA INC |
5001.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-08-29 |
KWEO111046684532 |
S E H AMERICA INC |
910.0 kg |
820411
|
CARDBOARD BOX (3926.90) |
2024-08-27 |
KWEO111046684565 |
S E H AMERICA INC |
3089.0 kg |
450310
|
PARTS FOR KP300 PULLER (6815.19) |
2024-07-26 |
KWEO111045821443 |
S E H AMERICA INC |
4683.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-25 |
KWEO111045821631 |
S E H AMERICA INC |
5758.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-25 |
NXGWTYOCMK69916 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-07-20 |
KWEO111045821255 |
S E H AMERICA INC |
5202.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |
2024-07-20 |
NEDFTYOCLX31784 |
S E H AMERICA INC |
5800.0 kg |
381700
|
MIXED ALKYLBENZENES AND MIXED ALKYLNAPHTHALENES, OTHER THAN THOSE OF HEADING 27.07 OR 29.02. |
2024-07-20 |
KWEO111046684226 |
S E H AMERICA INC |
475.0 kg |
710410
|
QUARTZ CONE (7020.00) |
2024-07-18 |
KWEO111045821432 |
S E H AMERICA INC |
5753.0 kg |
381800
|
SILICON WAFER DOPED FOR USE IN ELECTRONICS (3818.00) |